Dowa Electronics Materials Co., Ltd.

Yuto Hiyama

Takahiro Yamada

Kenichi Inoue

Toshihiko Ueyama

Takashi Hinotsu

Atsushi Ebara

Kozo Ogi

A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (Ddiameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 &#x3bc;m), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.

Growing community of inventors

Saitama, Japan

Yuto Hiyama