Hitachi High-tech Corporation

Shinkawa Ltd.

Yuto Hattori

Natsuki Tsuno

Satoshi Takada

Shigeru Hayata

Naoko Takeda

Hiroya Yuzawa

Nobuhiko Kanzaki

Provided is a technique and the like capable of specifying irradiation areas or irradiation positions of a beam and a light as clearly as possible. A charged particle beam apparatusincludes: a position adjustment markprovided on a stageand irradiated with a beam bl and a light a; and a mechanism setting an irradiation position of the beam bl and an irradiation position of the light awith respect to the stageand changing a relative positional relationship including a distance between the irradiation position of the light aand the stage. A computer systemgenerates a first image in which the position adjustment markis reflected based on a first detection signal obtained by irradiating the position adjustment markwith the beam b, generates a second image in which an irradiation area of the light ais reflected in the vicinity of the position adjustment markbased on a second detection signal obtained by irradiating the position adjustment markwith the light a, and adjusts an irradiation position of the beam band an irradiation position of the light abased on the first image and the second image obtained when a positional relationship is changed by the mechanism.

Charged particle beam apparatus

To improve alignment accuracy of an optical element. An alignment device includes an optical element, a base portion that holds the optical element and is supported in a state movable in an X-direction and a Y-direction intersecting with the X-direction, a mechanical driving unit driven by a pressure of a fluid, a member in contact with the base portion pushed by the mechanical driving unit, a stage portion that holds the member and is supported in a state movable in the Y-direction, the mechanical driving unit driven by a pressure of a fluid, and a member in contact with the stage portion pushed by the mechanical driving unit. The optical element has a position: adjusted by a balance between the pushing force by the mechanical driving unit and an elastomeric force in which at least one of the base portion and the member elastically deforms in the X-direction; and adjusted by a balance between the pushing force by the mechanical driving unit and an elastomeric force in which at least one of the stage portion and the member elastically deforms in the Y-direction.

Alignment device and optical device

A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

Bonding apparatus

Growing community of inventors

Tokyo, Japan

Yuto Hattori