Kansai Paint Company, Ltd.

Yutaka Yoshikawa

Kenji Seko

Naozumi Iwasawa

Takao Yamamoto

Ichiro Yoshihara

Tsutomu Maruyama

Jun Akui

Tetsuo Ogawa

Atsushi Akiyama

Satoru Furusawa

Junya Yoshitake

Kiyotake Fukawa

Motoko Okuhara

Yasuo Doi

Kiichi Mori

Water-based solder resist composition

Disclosed is an improved process for preparing a printed-circuit board, which comprises successive steps of electrodeposition coating of a photosensitive resin on a printed-circuit base plate to form a photosensitive resist film, exposure to light through a pattern mask, development and etching, the improvement further comprising a step of dipping the photosensitive resist film formed by electrodeposition coating into an aqueous solution comprising water as a major component and applying a voltage to carry out electroendosmosis, whereby the tendency of the photosensitive resist film to stick to the pattern mask is reduced.

Process for preparing a printed-circuit board

A composition for visible light sensitive electrodeposition coating which comprises (A) a photocurable resin having light sensitive groups capable of being crosslinked or polymerized by light irradiation and ionic groups, (B) a sensitizer which is excited by absorption of visible light and has a property to interact with the resin (A), (C) a water-insoluble polymerization initiator, and optionally, (D) at least one specific nitrogen-containing compound; and an image-forming method which comprises (i) coating the surface of a conductor by electrodeposition with the aforesaid composition, (ii) exposing the resulting film by electrodeposition by partially irradiating the film with visible light, and then (iii) contacting the resulting film with a developing solution to remove the unexposed areas.

Visible light sensitive electrodeposition coating composition and

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Hiratsuka, Japan

Yutaka Yoshikawa