Ricoh Company, Ltd.

Entegris, Inc.

Sanyo Chemical Industries, Ltd.

Yutaka Yoshida

Tomoyuki Ichikawa

Hideki Sugiura

Yasuaki Iwamoto

Satoshi Mochizuki

Tadao Takikawa

Toshihiko Kinsho

Hidetoshi Noda

Yukichi Koji

Shuhei Yahiro

A solution for selectively etching copper or a copper alloy from a microelectronic device, wherein the device simultaneously includes copper or a copper alloy and nickel-containing material, the solution being an etching solution for copper or a copper alloy comprising a chelating agent having an acid group in a molecule, hydrogen peroxide, and a surfactant having an oxyethylene chain in a molecule.

Etching solution for copper or copper alloy

Provided is a resin particle comprising a resin (a) and a filler (b) contained in the particle; the particle has a volume average particle diameter of from 0.1 to 300 &#x3bc;m and a shape factor of from 110 to 300; the particle has an outer shell layer (S) comprising at least a portion of the filler (b); the layer (S) is at least 0.01 &#x3bc;m thick and has a thickness that is &#xbd; or less of the maximum inscribed circle radius of the particle cross section. When used as a toner resin, it is excellent in blade cleaning properties and wide in the fixation temperature range; when employed as a paint additive or a cosmetics additive, it is excellent in masking properties; when used as paper coating additive, it is excellent in ink retention; when utilized as an abrasive, it is excellent in abrasion.

Resin particle and process of producing the same

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Kyoto, Japan

Yutaka Yoshida