Mitsubishi Electric Corporation

Kurita Water Industries Ltd.

Kabushiki Kaisha Topcon

Meiji Seika Kaisha, Ltd.

Mitsubishi Electric Cooperation

Sony Corporation

Yutaka Yoneda

Nobuyuki Sato

Junji Fujino

Kuniyuki Takahashi

Kouichi Tanaka

Masao Kikuchi

Hiroyuki Ohtsuka

Ryota Kosakai

Mikio Ishihara

Hiroaki Okada

Hidetoshi Ishibashi

Hiroki Nagahama

Masafumi Sugawara

Takashi Tsujimura

Manabu Kubo

Hajime Iseri

Shohei Ogawa

Shintaro Mori

Akihiro Matsusue

Tomohiro Maegawa

Shin Yoneya

Soichi Sakamoto

Tadayoshi Hata

Yoshitaka Onishi

Tatsunori Yanagimoto

Takuro Shinada

Masayuki Takasu

Naohiro Nagai

Kazuyoshi Shige

Kento Mori

Miho Nagai

Akira Iimura

Hideo Otaka

Kazuhiko Tsunoda

Yoichi Hironaka

Takao Sugawara

Jin Sato

An optical sensor module comprises a substrate, a photodetector which detects light and is fixed to the substrate and a lens holding member, to which a lens is fixed, which is fixed to the substrate at a position surrounding the photodetector, and the lens is fixed in the state in which an outer circumference of the lens is covered by a material itself of the lens holding member, and a part of an outer edge of the lens is exposed at a side of an outer surface of the lens holding member or at a side of an inner surface of the lens holding member.

Optical sensor module and manufacturing method thereof

A sensor module comprising: A sensor chip () is provided on an upper surface of the substrate (). A lens () is provided above the sensor chip () such that a light receiving unit of the sensor chip () is positioned in a projection area. A lens cap () includes a cap body () surrounding the sensor chip () to hold the lens (), and a cap edge part () protruding outward from a lower end part of the cap body (). An ultraviolet-curing type bonding agent () bonds the upper surface of the substrate () and a lower surface of the lens cap (). A cutout () is provided on an outer side surface of the cap edge part (). The bonding agent () enters in the cutout ().

Sensor module

A semiconductor module includes a sub-mount having a front surface, a back surface, side surfaces connecting the front surface and the back surface, a semiconductor element soldered onto the front surface of the sub-mount, and a block soldered onto the back surface of the sub-mount. The semiconductor element protrudes outward beyond a first side surface of the sub-mount, a concave portion is formed on each of a second side surface and a third side surface of the sub-mount perpendicular to the first side surface, the concave portion extending from the front surface of the sub-mount toward the back surface of the sub-mount, and the concave portion is disposed to allow a projection of a collet to be held in the concave portion with the front surface of the sub-mount held by suction by the collet.

Semiconductor module and method of manufacturing same

A optical module according to the present invention includes an optical semiconductor device, a package housing the optical semiconductor device, a first pattern provided on an upper surface of the package, a second pattern provided on a side surface continuous with the upper surface of the package, a flexible substrate provided on the first pattern and extending from the upper surface to a side surface side of the package and solder joining the first pattern and the flexible substrate together, wherein the solder is spread between a portion of the flexible substrate, the portion extending from the upper surface to the side surface side of the package, and the second pattern.

Optical module

The invention provides a bactericidal/algicidal method including adding an oxidant-based bactericidal/algicidal agent and a stabilizer therefor to a target water system, characterized in that the amount of combined chlorine or the stabilizer in the water system is controlled by generating free residual chlorine in the water system, and a bactericidal/algicidal method including adding an oxidant-based bactericidal/algicidal agent and a stabilizer therefor to a target water system, characterized in that the amount of the oxidant-based bactericidal/algicidal agent added is controlled so that the concentration of total residual chlorine in the water system falls within a predetermined range, and the amount of combined chlorine or the stabilizer is controlled so that the concentration of free residual chlorine in the water system falls within a predetermined range. An object of the present invention is to provide a bactericidal/algicidal method including adding an oxidant-based bactericidal/algicidal agent and a stabilizer therefor to a target water system for bactericidal/algicidal treatment, wherein the amount of combined chlorine or the stabilizer is controlled, and the amount of the oxidant-based bactericidal/algicidal agent added is controlled, which method realizes effective utilization of the stabilizer, to thereby reduce the amount of the stabilizer employed and to reduce COD and the amount of nitrogen derived from the stabilizer, and which method does not require a special control apparatus for in-line mixing as described above.

Bactericidal/algicidal method

An object of the invention is to provide: a manufacturing method for a highly reliable power semiconductor device which prevents breakage of an conductor pattern and an insulating layer, and has bonding strength higher than that by the conventional bonding between the electrode terminal and the conductor pattern; and that power semiconductor device. Breakage of the conductor pattern and the insulating layer is prevented due to inclusion of: a step of laying an electrode terminal on a protrusion provided on a conductor pattern placed on a circuit-face side of a ceramic board so that a center portion of a surface to be bonded of the electrode terminal makes contact with a head portion of the protrusion; a step of pressurizing and ultrasonically vibrating a surface opposite to the surface to be bonded, of the electrode terminal, using an ultrasonic horn, to thereby bond the electrode terminal to the conductor pattern.

Manufacturing method for power semiconductor device, and power semiconductor device

An electrode terminal includes: a first drawn-out part to be bonded to a main electrode; and a second drawn-out part that is formed of a plate member in a continuous fashion from one end portion to be positioned opposite to the main electrode with a gap therebetween until another end portion to be connected to an external circuit, so that a portion in the first drawn-out part that is adjacent to a portion therein to be bonded to the main electrode, is bonded to an opposing surface to the main electrode in said one end portion; wherein the first drawn-out part is formed so that the portion to be bonded to the main electrode is away from the opposing surface; and wherein an opening portion corresponding to the main electrode is formed in the second drawn-out part.

Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power

A semiconductor device of the present invention includes a bonding target and an electrode terminal bonded to the bonding target. The electrode terminal and the bonding target are bonded by ultrasonic bonding at a bonding surface to be subjected to bonding. The electrode terminal includes a penetrating hollow part surrounded on at least two sides by the bonding surface.

Semiconductor device and method of manufacturing the same

An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer plate. An opening portion is provided in the vicinity of an electrode strip formed on the outer side of the printed wire board. An electric power semiconductor element is disposed between the heat transfer plate and the printed wire board, and adhered to the heat transfer plate. A wiring member has one end bonded to a first bonding portion of a main power electrode of the electric power semiconductor element, and the other end is bonded to a second bonding portion. At least part of the second bonding portion is included in a space that extends from the main power electrode to the printed wire board, and the first bonding portion is included in a space that extends from the opening portion.

Electric power semiconductor device

The present invention provides a corrosion inhibition method which minimizes environmental adverse effects by using phosphate base anticorrosives without using zinc salt base anticorrosives and by reducing the concentration of the phosphate base anticorrosives, enables stable formation of an effective initial protective film, and does not affect water treatment after the formation of the initial protective film. In an initial protective film formation process of forming an initial protective film on a surface of an iron-based metallic member of a water system by adding anticorrosives to the water system, at least one selected from a group consisting of pyrophosphoric acids and pyrophosphates is employed as the anticorrosives and the initial protective film formation process is conducted such that the initial pH at the start of the initial protective film formation process is adjusted to be 5 or more and less than 7 so that the pH at the end of the initial protective film formation process becomes 7 or more.

Corrosion inhibition method

An apparatus for clogging blood vessels of an eye fundus includes an illuminating optical system () for illuminating an eye fundus of a subject, who has been given an injection of an infrared fluorescent agent, with infrared rays of light and exciting the infrared fluorescent agent so as to generate infrared fluorescence, a photographic optical system () for observing and photographing the eye fundus, and a projecting optical system () for projecting a laser beam of light having a specific wavelength onto the subject who has been also given an injection of a photosensitive substance which undergoes a photochemical change by the laser beam. In the apparatus, while a region which emits infrared fluorescence is being observed, the laser beam is projected onto the photosensitive substance so as to clog blood vessels of a diseased part in the depth of the eye fundus.

Medicine for clogging blood vessels of eye fundus

According to the method of treating water in a cooling water system, adhesion of fouling is on-line monitored by a compact and inexpensive apparatus and a slime control treatment is intensified according to the result of on-line monitoring. The water treatment is intensified in response to the change of electric potential of a sensor monitoring microbial fouling made of sensitized metallic material. When the electric potential of the sensor exceeds a threshold value, an agent is added through both chemical feeding pumps and When the electric potential lowers to the normal value, the agent is added only through the pump

Method of treating water in a water system

An apparatus for clogging blood vessels of an eye fundus includes an illuminating optical system (1) for illuminating an eye fundus of a subject, who has been given an injection of an infrared fluorescent agent, with infrared rays of light and exciting the infrared fluorescent agent so as to generate infrared fluorescence, a photographic optical system (2) for observing and photographing the eye fundus, and a projecting optical system (21) for projecting a laser beam of light having a specific wavelength onto the subject who has been also given an injection of a photosensitive substance which undergoes a photochemical change by the laser beam. In the apparatus, while a region which emits infrared fluorescence is being observed, the laser beam is projected onto the photosensitive substance so as to clog blood vessels of a diseased part in the depth of the eye fundus.

Corrosion of a metal member under heat transfer condition is monitored by using a test coupon made of the same material as that of the metal member. The test coupon may have a welded portion and a crevice. One substantial surface of the test coupon is heated by a sheet shaped heating element, and at least one portion of the other surface of the test coupon is contacted with the corrosive fluid. After detecting a status of corrosion of the test coupon, the corrosion of the metal member is monitored based on the results of the detection. In case a counter electrode or reference electrode is used, the electrode is immersed in the corrosive fluid, and electrical signals between the test coupon and the electrode are measured. Then, the corrosion of the metal member is monitored.

Corrosion monitoring

A medical photographic instrument includes a medical photographic portion and an electronic image recording portion. The medical photographic portion includes a monitor for displaying an observation image for alignment and a record image recorded in the electronic image recording portion and a display selecting circuit for making an alternate change between the observation image and the record image displayed on the monitor. The electronic image recording portion includes an operation changing circuit for making an alternate change between a recordable state and an image recording state according to a signal output by the medical photographic portion and a strobe synchronous circuit for outputting a strobe synchronizing signal according to which a strobe emits a flash of light when the recordable state is changed to the image recording state. The display selecting circuit makes an alternate change between the state in which the observation image is displayed and the state in which the record image is displayed in accordance with the signal output by the medical photographic portion.

Growing community of inventors

Tokyo, Japan

Yutaka Yoneda