Hitachi Chemical Company, Ltd.

Hitachi Chemical, Ltd.

Yutaka Yamaguchi

Isao Tsukagoshi

Atsuo Nakajima

Yasushi Goto

Tomohisa Ohta

Mitsuo Yokota

Yoshikatsu Mikami

Kenji Tsukanishi

Masaki Kamiya

Atsuo Sasama

Masao Asaoka

Takao Sugawara

Kuniteru Muto

Yoshiyuki Ikezoe

Tadamitsu Nakayama

An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

Process for connecting circuits and adhesive film used therefor

Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.

Process for repairing circuit connections

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

Method of using an anisotropically electroconductive adhesive having

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

Composition for circuit connection, method for connection using the

A substrate for high-frequency circuits best suited as a substrate for a flat antenna to receive satellite-broadcast microwaves or as a similar substrate, the substrate comprising (i) a porous insulator layer wherein the proportion by volume of open cells to all the cells is at least 50% and (ii) a metal foil laminated over at least one side of the insulator layer through (iii) a water-impermeable film, and a process for making such substrates.

Substrate for high-frequency circuit and process for making the same

Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.

Anisotropic-electroconductive adhesive composition, method for

An anisotropic-electroconductive adhesive film containing a small quantity of electroconductive particles having a special shape in an adhesive component layer which has a limited thickness is useful for connecting micro-sized circuits, etc. due to its anisotropy in electroconductivity and good transparency.

Anisotropic-electroconductive adhesive film

Thermoplastic resin foams such as polyethylene foams having excellent appearance can be produced with high foaming stability by using a blowing agent composition comprising (a) azodicarbonamide, (b) dinitrosopentamethylenetetramine, and (c) a phenolic or propionate compound such as 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-s-triazine-2-4-6-(1H, 3H, 5H)trion.

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Yuki, Japan

Yutaka Yamaguchi