Canon Kabushiki Kaisha

Yutaka Takase

Seiichi Kato

Norikazu Hirota

A mechanism enabling reduction of the size of a structure for mounting an image pickup device without affecting the amount of movement of an optical system even when screw insertion holes of a sensor plate are arranged closer to the optical axis. The sensor plate of an image pickup apparatus is mounted to a lens barrel with screws, and includes an attachment surface to which the image pickup device is attached and contact surfaces which are fixed to the lens barrel. The attachment surface is protruded from the contact surfaces. By bringing the attachment surface to the lens barrel in the optical axis direction, the device has an image pickup surface positioned with respect to the lens barrel in the optical axis direction. The sensor plate has an opening formed between the attachment surface and each contact surface, for absorbing deformation of the sensor plate.

Image pickup apparatus, including a fixing member, and having image pickup device package mounted thereon

An electronic apparatus having a heat-dissipating structure capable of efficiently releasing heat generated at electronic components to the outside, superior in work efficiency at the time of assembly, and capable of avoiding misalignment in the electronic components. The electronic apparatus comprising a substrate, an electronic component mounted thereon, a heat-dissipating member for releasing heat generated by the electronic component to the outside, a heat-conducting sheet having flexibility, a first portion thereof being in contact with a rear surface of the electronic component between the substrate and the electronic component, a second portion thereof being in contact with the heat-dissipating member, a hard member disposed between the first portion of the heat-conducting sheet and the substrate, a material of the hard member being harder than that of the heat-conducting sheet, and a pressing unit disposed between the hard member and the substrate and configured to press the heat-conducting sheet against the rear surface of the electronic component.

Growing community of inventors

Tokyo, Japan

Yutaka Takase