Sumitomo Chemical Company, Limited

Yutaka Shiomi

Shuichi Kanagawa

Kazuo Takebe

Kunimasa Kamio

Noriaki Saito

Yasuhiro Hirano

Masatsugu Akiba

Shigeki Naitoh

Mitsuhiro Shibata

Yasuhisa Saito

Takashi Morimoto

Shinichiro Kitayama

Yasuhiro Endo

Yasuhiro Miura

Katsuya Watanabe

Hiroshi Nakamura

Youichi Ueda

Hisao Takagishi

Noriyuki Arai

Kohichi Okuno

Masao Morikawa

Akira Morisaki

Mituaki Sunada

Satoru Haraguchi

Yasuhide Sugiyama

Saito Yasuhisa

A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.

Filler-containing resin composition suitable for injection molding and

An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

Unsaturated imide compounds containing alicyclic structure, process for

An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) ##STR1## wherein each R.sub.1, independent of the other, represents hydrogen, a hologen atom, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups, and X represents ##STR2## and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product exhibiting low hygroscopicity and high adhesiveness.

Epoxy resin composition and resin-encapsulated semiconductor device

An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.

Epoxy resin composition, process for producing the same and resin-sealed

The present invention provides a method of measuring particles and an apparatus for the same, which count only particles in liquid by distinguishing between the particles and bubbles in liquid. In order to fulfill the above requirements, in the present invention, liquid to be measured flows through a flow cell at a fixed flow rate, and a laser beam is irradiated thereto. Scattering light is generated when particles and bubbles pass through a laser beam irradiation region, and the scattering light is converted into a pulse signal by a photoelectric converter. In the pulse signals, a pulse signal having a pulse width of 100 .mu.S is regarded as corresponding to light scattered by a bubble, which is omitted from the number of pulse signals. Thus, only a pulse signal corresponding to light scattered by a particle in liquid can be measured.

Method of measuring particles and apparatus for the same

A process for encapsulating a semiconductor device involves the step(s) of encapsulating the device with an epoxy resin composites represented by the formula (2) ##STR1## in which R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.

Semiconductor device encapsulated with an epoxy resin and a process for

A pipe clogging detecting device which incessantly monitors states of a pipe through which fluid is flowing, and when clogging occurs, immediately alarms the occurrence of clogging to operators. The device includes a plurality of containers, a pipe interconnecting the containers, a vibration sensor provided on the pipe, and a detecting device for detecting the occurrence of clogging in the pipe, based on output signals from the vibration sensor.

Pipe clogging detecting device

The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.3 independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, l is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices.

Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the

An epoxy resin composition contains (a) an epoxy resin represented by the general formula (2) ##STR1## wherein R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.

Polyhydric phenol, and epoxy resin and epoxy resin composition derived

There is provided an epoxy resin composition represented by the general formula: ##STR1## wherein R.sub.1 represents an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, R.sub.2 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl group, and n represents an average number of repeating units of 0.1 to 1.6. Cured products prepared from the epoxy resin have a lower hygroscopicity and a balance between thermal resistance and curing performance.

Polyhydric phenol and epoxy resin and epoxy resin composition derived

A device for detecting a coagulation in a mixed phase container, such as a fluidized bed type olefin polymerization reactor, includes at least one coagulation detecting part mounted on an inner surface of the reactor, and a coagulation detecting circuit for outputting an electrical signal in response to a change in capacitance between a main electrode of the coagulation detecting part and the surrounding inner surface of the reactor. When any coagulation is attached on the inner surface of the mixed phase container, the state of production of the coagulation can be obtained from a change in output signal from the coagulation detecting circuit connected to the coagulation detecting part.

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Tsukuba, Japan

Yutaka Shiomi