Asahi Glass Company, Limited

Chukyo Kasei Kogyo Co., Ltd.

Yutaka Segawa

Otojiro Kida

Masao Tamura

Hiroshi Usui

Ryuichi Tanabe

Toshihiro Ohashi

Eiji Ichikura

Shinya Mine

Naoki Yoshida

Nobuhiro Nakamura

Hitoshi Onoda

Tsunehiko Sugawara

Yuichi Kuroki

Syuji Matsumoto

Atsuyoshi Takenaka

Masaru Yoshitake

Eiji Yanagisawa

Tetsuro Matsumoto

Hiroshi Wakatsuki

Yukio Morisawa

Masuo Sugisaki

Norio Doi

Ryoji Nishizawa

A diode chip is sealed by a glass material. There are provided a light emitting diode chip and a glass member in close contact with at least one portion of the surface of the light emitting diode chip. The glass member has a surface shape containing a curved surface at least a portion thereof. The curved surface is preferably a portion of a spherical surface or a spheroidal surface. The glass member has a surface shape containing a spherical portion and a flat portion, and the diode chip is preferably disposed on the flat portion.

Glass-sealed light emitting element, circuit board with the glass-sealed light emitting element, and methods for manufacturing those

The present invention relates to a color cathode ray tube and a glass frit to be used for it, and provides a color cathode ray tube which uses a glass frit containing as a crystallizing filler, an &agr;-4PbO.B O crystal powder and/or a Pb O crystal powder, and corpuscular &agr;-alumina, and at least one member selected from the group consisting of MgO, Fe O and monoclinic ZrO , for improvement of the strength at a sealed portion and for weight saving of the color cathode ray tube, wherein the maximum tensile stress generated at the above sealed portion is from 7 to 10 MPa when the inside is vacuumized, and the area ratio of crystal is at least 50% at the interface at the above sealed portion at at least the region at which the above maximum tensile stress is generated.

Color cathode ray tube and glass frit for color cathode ray tubes

A sealing composition having at least one member from &agr;-4PbO.B O crystal powder and Pb O powder incorporated in a total amount of from 0.0001 to 3 parts by weight to 100 parts by weight of a composition comprising at least 80 wt % and less than 98.99 wt % of a powder of PbO&mdash;ZnO&mdash;B O &mdash;SiO type crystalline low melting point glass, from 0.01 to 5 wt % of a zircon powder, more than 1 wt % and not more than 19.99 wt % of an &agr;-alumina powder and from 0 to 10 wt % of a low expansion ceramic filler.

Sealing composition

A mold for forming glass, which comprises a mold body made of stainless steel and having a mold surface comprising a sidewall portion and a face portion continuous from the sidewall portion, a coating film of ductile material formed on the sidewall portion, and a coating film of high hardness material having oxidation resistance, formed on the face portion.

Mold for forming glass and method for forming glass

A spray device which is provided with a nozzle for spraying a lubricant is arranged in proximity to a bottom mold and/or a plunger, and the nozzle is operated and controlled by a control device to spray the lubricant on a mold surface of the bottom mold and/or the plunger.

Glass forming machine and glass forming method

A glass forming lubricant comprising an organic titanate or an organic phospherous ester calcium salt as a lubricant agent.

Glass forming lubricant and glass forming method using it

Glass forming machine

A glass forming mold which comprises a substrate made of stainless steel and a coating comprising the following components formed as the outermost surface coating on the substrate: (1) from 40 to 94 wt % of nickel and/or cobalt as component A; (2) from 5 to 59 wt % of tungsten as component B; and (3) from 0.5 to 40 wt % of at least one transition element having a melting point of at least 2,200.degree. C. as component C.

Method for forming a glass product for a cathode ray tube

A ZrB.sub.2 composite sintered material consisting essentially of at least 1% by weight of SiC, at least 1% by weight of BN, at most 20% by weight of AlN, at most 20% by weight of B.sub.4 C, the rest being substantially ZrB.sub.2, provided that the total amount of SiC and BN is from 2 to 50% by weight.

ZrB.sub.2 composite sintered material

A ZrB.sub.2 composite sintered material consisting essentially of at least 1% by weight of SiC, at least 1% by weight of B.sub.4 C, at most 15% by weight of TiC, at most 35% by weight of TiN, at most 40% by weight of AlN, the rest being substantially ZrB.sub.2, provided that the total amount of SiC and B.sub.4 C is from 2 to 50% by weight.

Growing community of inventors

Chiba, Japan

Yutaka Segawa