Nitto Chemical Industry Co., Ltd.

Murata Manufacturing Co., Ltd.

Mitsubishi Rayon Company, Limited

Nikon Corporation

Sony Corporation

Nitto Kagaku Kogyo Kabushiki Kaisha

Yutaka Sasaki

Yoshimi Nakamura

Kunio Mori

Hiroshi Utsumi

Kiyoshi Moriya

Toshio Nakamura

Takanori Uejima

Yuji Takematsu

Hiroaki Tanaka

Naoya Matsumoto

Yutaka Kiyomiya

Akimitsu Morii

Tetsuro Harada

Dai Nakagawa

Kenichi Miyaki

Motoji Tsuda

Mitsunori Samata

Yuuki Fukuda

Kazuo Morishita

Masahide Takebe

Katsunari Nakazawa

Masato Otani

Hiroshi Yamamoto

Ichiro Sase

Tomio Nakamura

Hirokazu Watanabe

Yoshiaki Sukemori

Hiroshi Murata

Miroslav Svoboda

Shigeru Saito

Noboru Kato

Toshiro Hiratsuka

Yukiya Yamaguchi

Satoshi Arayashiki

Satoshi Goto

Masahiro Ozawa

Tomiya Sonoda

Masayuki Aoike

Masanori Yamaguchi

Toshiya Okabe

Shunji Yoshimi

Sho Matsumoto

Shou Matsumoto

Keiichi Hirose

Ryosuke Komatsu

Koichi Mizutani

Yuki Fukuda

Shinji Yamamoto

Hideo Takahashi

Koichi Sakamoto

Tatsuya Tsujiguchi

Atsuo Senda

Toshimi Kaneko

Shigeyuki Mikami

Kiyoshi Kanagawa

Nobuyuki Minami

Osamu Kanoh

Seiichi Kawato

Masafumi Mimura

Yoichi Iki

Yoneichi Ikeda

Norio Yoshida

Akihiro Sasabata

Takaaki Okamoto

Takuya Hashimoto

Hidefumi Nakanishi

Kazuya Sayanagi

Shigeyuki Mano

Ryosuke Hayashi

Yoshikazu Yagi

Yuki Terui

Masaharu Tashiro

Kohki Konishi

Naohiro Takahashi

Toshito Hiratsuka

Yuichi Tagawa

Petr Gazak

Takao Shimizu

Mao Hatto

Ken Ohyachi

Takashi Makita

Mikes Josef

Miki Kunitani

Svoboda Miroslav

Mikio Noda

Sedlak Roman

Johana Trojanova

Martin Sajdl

Jiri Sonsky

Martin Berger

Kouichi Mizutani

Akihide Nakano

An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit, a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a high thermal conductive member that has at least a part formed of a high thermal conductive material having a thermal conductivity higher than the first semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the high thermal conductive member overlaps at least a part of the first base and at least a part of the second base in plan view. The high thermal conductive member is in contact with the first base and the second base.

Integrated circuit and radio-frequency module

A radio-frequency module includes a first base made of a first semiconductor material; a second base that is made of a second semiconductor material having a thermal conductivity lower than that of the first semiconductor material and which includes a power amplifier circuit; a third base including a transmission filter circuit; and a module substrate having a main surface on which the first base, the second base, and the third base are arranged. The first base is joined to the main surface via an electrode. The second base is arranged between the module substrate and the first base in a sectional view and is joined to the main surface via an electrode. At least part of the first base is overlapped with at least part of the second base and at least part of the third base in a plan view.

Radio-frequency module and communication apparatus

A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.

Radio frequency module and communication device

An acquisition condition is decided for a second image of improved quality. Values xresulting from down sampling brightness values of an input first image are accepted by an input layer. A filter is scanned and a convolutional computation performed in a convolutional layer. Outputs zto zof the convolutional layer and a first image acquisition condition v=(v, v, v, v) of the first image are accepted by an output layer and a second acquisition condition y is computed by the output layer.

Microscope system

A high-frequency module includes a mounting substrate having main surfacesanda first circuit component mounted on the main surfacea second circuit component mounted on the main surfacean external connection terminal arranged on the main surfaceside relative to the main surfacewith respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surfaceside relative to the main surfacewith respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.

High-frequency module and communication apparatus

A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.

Radio-frequency module and communication device

An image processor includes an image generator configured to generate corresponding image data corresponding to first microscopic image data obtained under a first observation condition, based on second microscopic image data and third microscopic image data obtained under a second observation condition, and an image output unit configured to output the corresponding image data. The corresponding image data may be image data corresponding to a first focal plane from which the first microscopic image data are obtained, and wherein the second microscopic image data and the third microscopic image data may be image data on a second focal plane and a third focal plane, respectively, which are different from the first focal plane.

Image processing device, microscope system, image processing method, and program

A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.

Radio-frequency module, transmission power amplifier, and communication apparatus

An image processor including: an accepting unit that accepts designation of at least part of three dimensional image of a microscope, and an image generator that generates image data for displaying, on a display, a first magnified image which corresponds to the part of the three dimensional image designated and a second magnified image which corresponds to the part of the three dimensional image designated and which is different from the first magnified image.

Image processing device, microscope system, image processing method, and computer program for displaying magnified images from different observation directions

An image processor includes an accepting unit that accepts designation of at least part of a three dimensional microscope image data, and an image generator that generates three dimensional magnified image data based on the designation. In the image processor, the image generator may sequentially output a first magnified image based on at least part of data of the three dimensional magnified image data, and a second magnified image based on the at least part of data of the three dimensional magnified image data which has at least part of data different from the first magnified image.

A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.

High frequency module and communication device

A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.

A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.

A fluorescence microscopeincludes an illumination optical systemthat illuminates a sample with excitation light, fluorescence detection optical systemsandthat detect fluorescence from the sample, optical membersandthat are disposed on an optical path of the illumination optical system and on an optical path of the fluorescence detection optical system, have different wavelength characteristics with each other, and are included in the illumination optical system and in the fluorescence detection optical system, a memorythat stores the wavelength characteristic of each of the optical members, and a displaythat displays each of the wavelength characteristic read out from the memory on the same frame, and displays fluorescence detection wavelength range of a detectable fluorescent dye added to the sample.

Fluorescence microscope

An object of the present invention is to provide a microscope system and an image processing method which are practical and capable of imaging a specimen efficiently in a short period of time and also ensuring reduction of the data amount of a generated image. Accordingly, the microscope system includes a storage sectionwhich stores identification information of a specimenA, a macro image and a micro image in a correlated manner, a stage memberon which the specimen as an observation target is mounted, an acquiring sectionB,which acquires identification information of the specimen, a first display sectionwhich displays a macro image of the specimen by reading a macro image correlated with the identification information from the storage section (or by imaging the specimen), a second display sectiontowhich displays a micro image of the specimen by imaging the specimen, and an additional storing sectionwhich additionally stores in the storage section in accordance with instruction from outside a micro image displayed on the second display section in a correlated manner with the macro image displayed on the first display section and the identification information acquired by the acquiring section.

Microscope system and image processing method used for observation of a specimen

Growing community of inventors

Yokohama, Japan

Yutaka Sasaki