Sony Corporation

Epson Imaging Devices Corporation

Yutaka Ozawa

Shuzo Sato

Hiizu Ohtorii

Yasuharu Ohkawa

Taiichi Kusano

Kenichi Tajiri

Suguru Yamazaki

Masatoshi Futatsuya

An electrooptical apparatus includes a display unit that emits display light, a light emission stopping unit that stops emission of the display light in the display unit, a light receiving unit that receives outside light around the display unit while emission of the display light is stopped, an accumulating unit that accumulates the amount of outside light received by the light receiving unit, and a calculating unit that calculates the light intensity of outside light on the basis of the time taken for the accumulated amount of outside light received to exceed a predetermined threshold.

Electrooptical apparatus, electronic device, and apparatus and method for detecting outside light

An electro-optical device includes an X address decoder that selects one of plural X selection lines, a Y address decoder that selects one of plural Y selection lines, and plural pixel blocks. Each pixel block is provided with respect to an intersection of a corresponding X selection line and a corresponding Y selection lines. Each pixel block includes a pixel circuit and the pixel circuits corresponding to a column share a bit line and a complementary bit line. Each pixel circuit includes a memory circuit, a selection circuit, and a pixel electrode. The memory circuit includes plural transistors that become conductive between the bit line, the complementary bit line, and terminals of the memory circuit at the time of concurrent selection of an X selection line and a Y selection line corresponding to the pixel block to which the plural transistors belong.

Electro-optical device having a memory circuit for each pixel and that can display with low power consumption

Disclosed is a polishing system used for polishing a surface to be polished of an object to be polished by a polishing pad, which is capable of improving uniformity of the surface to be polished of the object to be polished by positively, accurately adjusting a polishing pressure, and a polishing method using the polishing system. Concretely, the surface to be polished of a wafer as the object to be polished is polished by relatively moving, along a plane, a polishing surface of the rotating polishing pad and the surface to be polished of the wafer in slide-contact with each other, and adjusting a pressing force applied from the polishing pad to the wafer in accordance with a polishing pressure previously set depending on a relative-positional relationship between the polishing surface of the polishing pad and the surface to be polished of the wafer.

Polishing system, polishing method, polishing pad, and method of forming polishing pad

Polishing system and method with polishing pad pressure adjustment

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Minowa-cho, Japan

Yutaka Ozawa