Kabushiki Kaisha Toyota Chuo Kenkyusho

Toyota Jidosha Kabushiki Kaisha

Tohoku University

Other

Yutaka Nonomura

Motohiro Fujiyoshi

Kouji Tsukada

Teruhisa Akashi

Yoshiteru Omura

Masaharu Takeuchi

Hirofumi Funabashi

Takeshi Morikawa

Masayoshi Esashi

Shuji Tanaka

Takahiro Nakayama

Hitoshi Yamada

Ui Yamaguchi

Yoshiyuki Hata

Mitsutoshi Makihata

Masanori Muroyama

Yuji Nishibe

Norio Fujitsuka

Takashi Ozaki

Sakae Matsuzaki

Nobuyoshi Sugitani

Keiichi Shimaoka

Isao Aoyagi

Hisayoshi Sugihara

Jun Sugiyama

Kanae Murata

Masayuki Okuwa

Hirofumi Komatsubara

Kazuhiro Sakurai

Yoshiki Chujo

Kimitoshi Tsuji

Kazuyoshi Tomita

Kenji Harada

Jiro Sakata

Takashi Takeuchi

Tetsuo Narita

Hideya Yamadera

Masanori Miyashita

Yutaka Obuchi

Sanae Tokumitsu

Masato Sahashi

Nobuo Kurata

Kazuyoshi Kawaguchi

Masaaki Abe

Makoto Kubokawa

Eiji Taki

Naoki Igushi

Kazunobu Asai

Koji Tsukada

The present application discloses a deflector including a substrate portion, a movable portion, a reflective portion, a support portion, and a moving mechanism. The movable portion is supported by a first end of the support portion. A second end of the support portion is supported by the substrate portion. An end of the movable portion is capable of coming into contact with the substrate portion. The reflective portion is formed on the movable portion. The moving mechanism is capable of driving the movable portion so as to bring the movable portion into at least any one of a first state, a second state, a third state, and a fourth state.

Deflector

Teaching disclosed herein is an apparatus comprising a support layer. The support layer may be adapted for supporting a heat generator, wherein the support layer includes a flow passage. The flow passage may seal working fluid therein. The flow passage may extend along a thickness direction of the support layer.

Apparatus and method of manufacturing a support layer

An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.

Integrated device

A MEMS device includes a substrate, a moving part including a magnetic material and configured to tilt relative to the substrate, a first magnetic pole and a second magnetic pole configured to apply a magnetic field to the magnetic material, and a magnetic field detector configured to detect the magnetic field of the magnetic material. In the MEMS device, the first magnetic pole and the second magnetic pole are disposed on one side of the moving part, the one side being a side on which the magnetic material is located. The magnetic field detector is disposed between the first magnetic pole and the second magnetic pole. A distance between the first magnetic pole and the second magnetic pole is shorter than a length of the moving part in a direction from the first magnetic pole toward the second magnetic pole.

MEMS device

A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.

Touch sensor system

Provided is technique for a semiconductor device including a substrate and a tilting plate which is tiltable relatively to the substrate, the technique being capable of effectively suppressing warpage of the tilting plate. The semiconductor device of the present specification includes a substrate and a tilting plate which is tiltable relatively to the substrate. In the semiconductor device, a rib formed of wavelike portions where a plate thickness is substantially uniform is formed on the tilting plate.

Semiconductor device

A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives.

Dynamic quantity sensor and dynamic quantity sensor system

Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.

Sensor device having electrode draw-out portions through side of substrate

In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the third layer is formed. The first trench forms a first part of an outline of the movable portion in a view along the stacked direction. The second trench forms a second part of the outline of the movable portion in the view along the stacked direction. At least a part of the first trench overlaps with the first extending portion in the view along the stacked direction.

MEMS structure and manufacturing method thereof

A structure having a first movable portion displaced perpendicular to a substrate surface and a second movable portion displaced parallel to the substrate surface is realized by a laminated structure employing a nested structure for the first portion and the second portion. The laminated structure is provided with inner and outer movable portions. A y spring is connected to the outer portion, and the outer portion is supported in a y-axis direction by the y spring at a height apart from an outer substrate. A z spring is connected to the inner portion, and the inner portion is supported in a z-axis direction by the z spring at a height apart from the outer substrate. The outer portion and the z spring are at different heights from the substrate, and the z spring overpasses across the outer portion at a height apart from the outer movable portion.

Laminated structure provided with movable portion

When forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in which a trench is formed in a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern which compensates for sudden changes in the width of the trench is formed at a place at which the width of the trench changes suddenly. In the semiconductor layer of the above-described semiconductor device, since a compensation pattern is formed at a place at which the trench width changes suddenly, in the case where forming the trench using a deep RIE method, the occurrence of steep inclined portions arising from semiconductor residue can be prevented. Consequently, when forming a trench of a narrow width in a thick semiconductor layer, the occurrence of semiconductor residue can be prevented.

Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.

Sheet-like tactile sensor system

An apparatus with a second movable portion that moves along an x-axis direction and a z-axis direction and a first movable portion that only moves along the z-axis direction is disclosed. The apparatus is provided with a fixed portion fixed to a support portion, a plurality of first spring portions connected to the fixed portion, a first movable portion connected to the plurality of first spring portions, a second spring portion connected to the first movable portion, and a second movable portion connected to the second spring portion. A spring constant of each of the plurality of first spring portions in the z-axis direction is lower than spring constants of each of the plurality of first spring portions in the x-axis and a y-axis directions respectively, and a spring constant of the second spring portion in the x-axis direction is lower than spring constants of the second spring portion in the y-axis and the z-axis directions respectively. The first movable portion is configured to move along the z-axis but not to move along the x-axis and the y-axis nor to rotate around the z-axis, and the second movable portion is configured to move along the x-axis and the z-axis with respect to the support portion.

Apparatus having a movable body

The micro device includes a support substrate, and a movable structure configured to move with respect to the support substrate. At least one of the support substrate and the movable structure is provided with at least one protrusion protruding towards the other of the support substrate and the movable structure. Further, a base portion extending into the one of the support substrate and the movable structure is provided integrally with the at least one protrusion. With this configuration, the protrusion is securely held by the base portion, and the detachment of the protrusion can therefore be prevented even after repeated collisions between the support substrate and the movable structure via the protrusion.

Micro device having a movable structure

A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.

Sensor system

Growing community of inventors

Nagoya, Japan

Yutaka Nonomura