Hokuriku Electric Industry Co., Ltd.

Hokuriku Electric Co., Ltd.

Yutaka Nomura

Katsumi Takeuchi

Hiroyuki Kurokawa

Shinji Okamoto

A method of manufacturing a connector chip includes preparing a plate-like insulating substrate material with a plurality of through hole rows arranged therein; forming a plurality of first and second base layers on opposite surfaces of the insulating substrate material; forming insulating layers between each two adjoining first base layers and between each two adjoining second base layers; forming third base layers on the one side over edge portions of the first base layers, internal surfaces of the through holes, and edge portions of the second base layers; forming fourth base layers on the other side over edge portions of the first base layers, the internal surfaces of the through holes, and edge portions of the second base layers; cutting the insulating substrate material along a middle of each of the through hole rows; and forming one or more plated layers over the first to fourth base layers.

Method of manufacturing a connector chip

A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodesare formed so that thicknesses of the pair of surface electrodes increase from a resistor layertoward end portionsof an insulating substratein a direction in which the pair of surface electrodesare arranged. A plating reservoir S is formed between one of the surface electrodesand an insulating protective layer. When forming at least one plated layera plated metal pools in the plating reservoir S. The at least one plated layermay work to reduce to some extent a height difference between a soldering electrode portionand the insulating protective layer

Chip-like electric component and method for manufacturing the same

A terminal structure of a chip-like electric component capable of blocking entry of electromigration-causing factors through an insulating resin layer in the vicinity of the peak of a raised portion of an electrical element forming layer is obtained. A metal-glaze-based front electrodecontaining silver is provided on a surface of an insulating ceramic substrate. A resistor layerelectrically connected to the front electrodeis provided on the substrate surface. A glass layeris provided to completely cover a surface of the resistor layeras well as a surface of an end portion of the resistor layerand also to partially cover the front electrode. An insulating resin layeris provided to cover a surface of the glass layeras well as a surface of at least an end portion of the glass layerand to partially cover the front electrode. A conductive layermade of a resin-based conductive paint is provided to extend over the surface of the front electrodeand an portion of the insulating resin layerin the vicinity of the peak of raised end portion of the insulating resin layer. The resin-based conductive paint is made by kneading particulate conductive silver powder and scale-like conductive silver powder into an epoxy-based insulating resin paint.

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Toyama, Japan

Yutaka Nomura