Fujitsu Corporation

Yutaka Noda

Masayuki Kitajima

Toru Okada

Masanao Fujii

Masakazu Takesue

Hidehiko Kobayashi

Hisao Tanaka

Keiichi Yamamoto

Yoshitaka Muraoka

Seiichi Shimoura

Kenji Iketaki

Tadaaki Shono

Fumihiko Tokura

Ryoji Matsuyama

Hitoshi Homma

An optical module has a substrate having a substrate surface provided with terminal pads and landing pads, and an optical element package having terminals and mounted on the substrate surface with a gap formed therebetween. The gap between the optical element package and the substrate surface is determined by the landing pads when the optical element package is mounted on the substrate surface. The terminal pads and the landing pads are exposed in a state where the optical element package is mounted on the substrate surface, and the terminal pads are electrically connected to corresponding terminals by solder.

Optical module

The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding memberincluding a holding wallair-tightly closing a space S that holds a plurality of balls B having the same size and in which a holelarger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup meansfor blowing the balls B held in the holding memberupward; and capturing meansfor capturing a ball B blown up by the blowup meansand reached the hole.

Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method

An optical module is produced by coating, with respect to a substrate having a substrate surface provided with terminal pads and landing pads a solder material on the terminal pads, mounting an optical element package having terminals and a flat top surface on the substrate using the landing pads so that the top surface becomes approximately parallel to the substrate surface and a gap is formed between a bottom surface of the optical element package and the substrate surface, preheating the terminal pads simultaneously as the mounting, and electrically connecting the terminal pads to corresponding terminals of the optical element package by melting the solder material and thereafter hardening the solder material.

Optical module producing method and apparatus

A solder alloy having a solderability comparable to that of a conventional Pb&#x2014;Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.

Solder alloy and soldered bond

A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method

A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

Method of assembling micro-actuator

A method of manufacturing a template having through-holes for attracting and supporting electrically conductive balls by vacuum suction is disclosed. The through-holes are formed by etching and the side walls of the through-holes are smoothed by irradiation, with laser beams, of the side walls of the through-holes. A template and metallic bumps can be formed using this method. Alternatively, the template can be formed in a two-layered structure.

Method of forming bumps and template used for forming bumps

A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb&mdash;Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.

A method of forming bumps onto a chip having electrodes. The method includes the use of a template having through-holes arranged in correspondence to the electrodes of the chip. The template holds conductive balls to be formed into bumps to the template at the through-holes by vacuum suction. The through-holes of the template are formed by a laser, by supporting a glass plate on a support table having cavities and irradiating the plate with laser beams at the position of the cavities.

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Kawasaki, Japan

Yutaka Noda