Sumitomo Electric Industries, Limited

Sumitomo Electric Device Innovations, Inc.

Yutaka Moriyama

Tatsuya Hashinaga

Yasushi Fujimura

Sosaku Sawada

Michio Suzuki

Tomoya Saeki

Takehiko Kikuchi

Masaru Takechi

Seiji Kumagai

Satoru Kanemaru

A method for manufacturing a semiconductor device includes preparing a first substrate provided with a first pattern on a first surface, and a semiconductor chip having a second surface, and a third surface opposite to the second surface, and including a second pattern provided on the second surface, recognizing the first pattern from a position near the first surface among the first surface and an opposite surface thereof in the first substrate, recognizing the second pattern by transmitting through the semiconductor chip from a position near the third surface among the second surface and the third surface in the semiconductor chip, aligning the semiconductor chip and the first substrate based on a recognition result of the first pattern and the second pattern, and bonding the semiconductor chip to the first substrate so that the second surface faces the first surface.

Semiconductor device and method of manufacturing the same

A high frequency amplifier includes an asymmetric Doherty amplifier configured to amplify a high frequency signal having a wavelength λ, the high frequency signal being input, and the asymmetric Doherty amplifier including a carrier amplifier and a peak amplifier, the peak amplifier being configured to start an amplifying operation when an output of the carrier amplifier reaches a saturation region and having a saturation output different from a saturation output of the carrier amplifier, a driver amplifier configured to drive the asymmetric Doherty amplifier, a branch circuit configured to branch the high frequency signal amplified by the driver amplifier into an input path on a peak amplifier side and an input path on a carrier amplifier side, a phase adjustment circuit configured to delay either a phase of a signal input to the peak amplifier or a phase of a signal input to the carrier amplifier, the phase adjustment circuit being provided on either the input path on the peak amplifier side or the input path on the carrier amplifier, a first substrate on which the carrier amplifier and the peak amplifier are mounted, and a second substrate on which the driver amplifier, the branch circuit, and the phase adjustment circuit are mounted. An input terminal of the driver amplifier and an input terminal of the carrier amplifier are disposed at positions where the input terminal of the driver amplifier and the input terminal of the carrier amplifier project to each other when the second substrate is stacked on the first substrate. An electrical length from the input terminal of the driver amplifier to an output terminal of the carrier amplifier is set to a phase of (2n+1)×π, where n is an integer greater than or equal to 0.

High frequency amplifier

A high-frequency amplifier includes a driver amplifier, a Doherty amplifier including carrier and peak which amplify the driver amplifier output, a second substrate laminated on a first substrate, and a base member mounted with the first and second substrates. The driver amplifier is mounted on the second substrate, and the carrier and peak amplifiers are mounted on the first substrate. A front surface of the driver amplifier opposes the first substrate, and a back surface of the driver amplifier is separated from the first substrate. Back surfaces of the carrier and peak amplifiers contact the base member, and the back surface of the driver amplifier connects to an interconnect layer disposed on the second substrate and connected to one end of a via penetrating the second and first substrates, and the other end of the via connects to the base member.

High-frequency amplifier

A high frequency amplifier includes an asymmetrical Doherty amplifier having a carrier amplifier, a peak amplifier, a branch circuit, and a phase adjusting circuit, a driver amplifier, and a base member mounting a first circuit board mounting the driver amplifier, the carrier amplifier, and the peak amplifier and a second circuit board mounting the circuits. The branch circuit divides a path of a RF signal into input paths of the peak and carrier amplifiers. The driver amplifier, the carrier amplifier, and the peak amplifier have rear surfaces in contact with the base member. The electrical length from the output terminal of the driver amplifier to the input terminal of the peak amplifier, when converted based on a phase of the signal, is from (2n+1)×π−π/4 to (2n+1)×π+π/4, where n is an integer greater than or equal to zero.

A high frequency amplifier includes an asymmetrical Doherty amplifier having a carrier amplifier, a peak amplifier, a branch circuit, and a phase adjusting circuit, a driver amplifier, and a base member mounting a first circuit board mounting the driver amplifier, the carrier amplifier, and the peak amplifier and a second circuit board mounting the circuits. The branch circuit divides a path of a RF signal into input paths of the peak and carrier amplifiers. The driver amplifier, the carrier amplifier, and the peak amplifier have rear surfaces in contact with the base member. The electrical length from the output terminal of the driver amplifier to the input terminal of the peak amplifier, when converted based on a phase of the signal, is from (2n+1)×π−α/4 to (2n+1)×π+π/4, where n is an integer greater than or equal to zero.

A process of installing optical components as precisely aligning optical axes thereof is disclosed. The process, which relates to an optical module having a signal port and/or a local port, and optical components optically coupling the ports with an active device having a built-in photodiode (PD), includes steps of (a) preparing a reference mirror that emulates a housing with a side to which the ports are attached, (b) aligning an optical axis of the auto-collimator with an optical axis of the reference mirror; (c) replacing the reference mirror with the housing; (d) aligning optical axes of the optical components with the optical axis of the auto-collimator; and (e) installing the optical components within the housing.

Method of producing optical module and optical module

An optical module that implements an MMI device including an optical hybrid primarily made of semiconductor material is disclosed. The MMI device, which has a rectangular plane shape and includes multi-mode couplers, is mounted on a carrier. The carrier provides a step extending in a whole lateral width of a top surface thereof, where the step makes a gap against the MMI device in an area where the MMI couplers are formed.

Optical module having multi-mode coupler formed on semiconductor substrate

A method to assemble a pig-tailed optical module and an arrangement thereof are disclosed. The method includes a step to recover the optical coupling efficiency between the optical device in the optical module and the pig-tailed fiber. The method includes a step to iterating the YAG laser welding at points axially distributed but with an inconstant pitch as slightly rotating the optical module around the optical axis of the pig-tailed fiber clock wise and counter clock wise depending on the enhancement and/or the degradation of the optical coupling efficiency between the optical device and the pig-tailed fiber.

Optical module with pig-tailed fiber and method to assembly the same

The present invention provides an optical module, in which aligning adjustment is much easier than conventional module while a high optical coupling efficiency between an optical fiber and a semiconductor device is maintained. The module comprises a structure for effectively suppressing the decrease in optical coupling efficiency caused by changes in ambient temperature. The optical module comprises an optical reflecting member having a reflecting surface with a concave surface form for optically coupling the optical fiber and the semiconductor device to each other, and a deterioration-suppressing structure in which the change in shape of the reflecting member caused by changes in ambient temperature effectively suppresses the deterioration in optical coupling state between the optical fiber and semiconductor device due to changes in temperature or the like.

Optical module and optical reflecting member

A bonding method for effectively preventing once-adjusted members from positionally deviating is disclosed. In this method, when applied to a method of making an optical module in particular, a holding member such as a magnet which generates a magnetic force against a housing is attached to, and a relative position of an optical reflecting member once adjusted by the holding member is held. As a result of this configuration, the optical reflecting member is effectively prevented from positionally deviating.

Growing community of inventors

Yokohama, Japan

Yutaka Moriyama