Mitsubishi Denki Kabushiki Kaisha

Katayama Chemical, Inc.

Yutaka Morita

Yasutsugu Tsutsumi

Sueyoshi Tanaka

Hiromichi Yamada

Tatsuro Takahashi

Minoru Tanaka

Kunito Sakai

Shunji Yamauchi

Hiroki Mieda

Toru Kidera

Sueyosi Tanaka

Yasutugu Tutumi

Kenitiro Sakamoto

Hideaki Suezaki

Kiyoshi Ishibashi

Isamu Yamamoto

Kiyoji Imanaka

Mamoru Matsumoto

Masahiro Yamane

Hideaki Seuzaki

Junji Hayashi

Takashi Syouji

Hideo Kawamoto

Toshimi Watanabe

Keiji Itoga

A method of removing volatile chlorinated hydrocarbon base materials contained in soil is provided wherein an inorganic compound that is an oxide of an alkali metal or an alkaline earth metal or a sulfate of an alkaline earth metal, which undergoes an exothermic reaction with water, is mixed in powder or granular form with soil containing a water content of 10% to 30% by weight and volatile chlorinated hydrocarbon base material having a normal boiling point in the range of about 60.degree. to about 120.degree. C., the inorganic compound being mixed with the soil in an amount of 0.01 to 0.5 times the weight of the water content.

Method of removing volatile chlorinated hydrocarbon base materials

A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to each of the chase blocks so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges.

Resin sealing apparatus

A resin sealing apparatus includes upper and lower dies each having a chase block with a plurality of cavities into which molten resin is injected and a supporting member for supporting the chase block, the chase blocks of the upper and lower dies being fitted to each other, and a position determining member attached to a center block so that the positions of the chase blocks are determined when they are assembled, wherein each of the chase blocks is attached to each of the supporting members so as to be movable in the vertical and lateral directions within given ranges. The center block is provided on the supporting member and is disposed between two of the chase block with center plates interposed therebetween to form an integral unit.

A method of resin sealing semiconductor devices wherein semiconductor devices, such as semiconductor chips, are placed in cavities provided in a pair of chase blocks which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks to resin seal the semiconductor devices.

Method of resin sealing semiconductor devices

An apparatus for producing a semiconductor device includes a dust-proof cover which covers a dust-generating portion in the apparatus such as a mold for effecting resin-molding of the semiconductor device composed of a lead frame and semiconductor chips wire- and die-bonded thereto, and a dust collecting device for collecting dust which is suspended by the air inside the dust-proof cover.

Apparatus and method for producing semiconductor device

Apparatus for resin sealing semiconductor devices is disclosed, wherein semiconductor devices such as semiconductor chips are placed in cavities provided in a pair of chase blocks, which are clamped by a press machine through support members capable of elastic compressive deformation. Plastic is then injected into the cavities of the chase blocks such as to resin seal the semiconductor devices. Also disclosed is a device for resin sealing semiconductor devices, which device comprises: a pair of chase blocks equipped with cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members adapted to hold the chase blocks over the respective press surfaces of the press machine and to undergo elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities provided in the chase blocks.

Device for resin sealing semiconductor devices

A resin-molding tablet for use in resin-molding semiconductor devices has a tablet body formed of powdered or particulate resin. The particles of the resin are compacted such as to form voids between adjacent particles. At least the outer peripheral region of the tablet is fused such that the resin particles are welded together to form a continuous layer of fine and impervious structure substantially free of open pores. The internal air trapped in the voids of the tablet is drawn and removed before the tablet is fused so that the tablet is substantially free of air. The tablet is produced by placing a particulate or powdered resin material in a vacuum vessel so as to allow the internal air in the resin material to be drawn outside, and then applying pressure and heat to the resin material so that at least the peripheral region of the mass of the particulate resin is fused to weld together. The tablet thus formed is melted and forcibly fed into a vacuum die cavity in which a semiconductor device to be molded is accommodated, thereby to hermetically seal the semiconductor device. Thus, a semiconductor package having substantially no voids is produced.

Method for producing a tablet for resin-molding semiconductor devices

An apparatus for producing a semiconductor device includes a dust-proof cover which covers a dust-generating portion in the apparatus such as a mold for effecting resin-molding of the semiconductor device composed of a lead frame and semiconductor chips wire- and die-bonded thereto, and a dust-collecting device for collecting dust which is suspended by the air inside the dust-proof cover.

Apparatus for producing semiconductor device

A device for resin sealing semiconductor devices includes a pair of chase blocks having cavities for holding semiconductor devices, a press machine for pressing the chase blocks against each other through a pair of press surfaces, a plurality of support members for holding the chase blocks over the respective press surfaces of the press machine and undergoing elastic compressive deformation during the press operation of the press machine, and a plastic injector for injecting plastic into the cavities in the chase blocks.

Tablet for resin-molding semiconductor devices

The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction. The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.

Growing community of inventors

Fukuoka, Japan

Yutaka Morita