Hitachi, Ltd.

Hitachi Industrial Equipment Systems Co., Ltd.

Yutaka Maeno

Yasushi Sasaki

Satoshi Ibori

Masayuki Hirota

Kazuyuki Fukushima

Yoshihiro Uchino

Mingxi Huang

Kiyotaka Tomiyama

Shogo Tani

Hiroshi Fujii

Toshio Ogawa

Kinya Nakatsu

Kazuji Yamada

Akihiro Tamba

Shingo Ueyama

Seiji Hashiguchi

Keiichi Hasegawa

Masaaki Hachiya

A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.

Power transducer

A frequency converter includes a circuit substrate, a housing that covers at least the circuit substrate, a radiating section in which gases at an intake face are exhausted from an exhaust face so as to radiate heat, a fan provided on the exhaust face of the radiating section, and a guide provided on the housing to direct gases around the circuit substrate toward the intake face.

Frequency converter

Measures are provided to prevent temperature rise caused by that heat generated from power elements, which is radiated inside a housing. In a housing comprising a radiating section and a cooling fan, a guide is provided on a part of the housing to be made longer a predetermined value than the radiating section. When the cooling fan performs forced cooling through the guide, gases heated by a substrate that generates much heat are prevented from flowing onto a substrate that generates comparatively less heat, to heat the substrate that generates comparatively less heat. Therefore, for example, the substrate that generates much heat is arranged in a position nearer to the cooling fan than the substrate that generates comparatively less heat. Alternatively, the substrate that generates much heat is arranged in a position nearer to the intake face than the substrate that generates comparatively less heat. By providing the guide on the housing, an existing fan can radiate heat from the substrate that generates much heat, the substrate that generates comparatively less heat, etc., thereby enabling reduction in temperature rise.

In a semiconductor device, a lead frame is adhered to a base substrate for heat dissipation via an insulating layer, and an outward guided terminal portion is formed by perpendicularly upwardly bending an end of the lead frame after the mounting of one or more of power semiconductor elements on the lead frame. A recessed portion is formed beforehand in a portion of the lead frame to be bent, and it is ensured that the lead frame does not adhere to the surface of the base substrate in this recessed portion when the lead frame is adhered to the base substrate via the insulating layer before the bending of the lead frame. By virtue of this structure, manufacturing is simplified and manufacturing costs are reduced.

Power converter with improved lead frame arrangement including stand-up portion

Lead frame for a semiconductor device

In order to bring a moduled power converter into less size and cost in the case of a structure having a lead-insert-case, an insulated metal circuit board and a printed circuit board, a difficulty was encountered in thinning a wiring width and an increase in pad area for each metal wire has interfered with a reduction in its size and cost. In the present invention to cope with it, a power converter is constructed by using a semiconductor module having such a structure that a metal base and lead frames are adhered to each other in a state in which an insulating adhesive sheet is interposed therebetween, a resin-molded outer package is adhered to the metal base with an adhesive or the like, and a resin sealing agent is charged into the resin-molded outer package to thereby integrally seal the resin-molded outer package and circuit parts such as semiconductor elements implemented therein, whereby a reduction in size and cost thereof is realized.

Semiconductor module, power converter using the same and manufacturing

A printed circuit board is provided on its surface with position detecting patterns at specific positions with respect to conductor patterns for connecting the leads of an integrated circuit. The position of the lead connecting conductor patterns is obtained an indirect manner through a calculation based on the positional information of the position detecting patterns.

Printed circuit board and a method of recognizing the position of

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Yotsukaido, Japan

Yutaka Maeno