Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Yutaka Kumano

Tetsuyoshi Ogura

Toru Yamada

Koichi Hirano

Shingo Komatsu

Hideki Iwaki

A pair of discretionary points on a principal surface of a block are coupled to each other with a metal wire having a length larger than a distance between the pair of discretionary points, liquid resin is applied to the principal surface so as to cover the metal wire and then cured, so that a resin-cured material is formed, and the upper-surface portion of the resin-cured material is removed together with an intermediate portion of the metal wire, and then the block is removed from the resin-cured material.

Semiconductor device and manufacturing process thereof

An equivalent material constant calculation system that calculates an equivalent material constant of a structure constituted by a plurality of materials includes a shape data input portion that inputs shape data, a material data input portion that inputs material constant data, a dividing portion that divides the structure into a plurality of small regions, and a small region interior calculation portion that calculates equivalent material constants in the small regions, in which the small region interior calculation portion, based on the shape data and material constant data, with a function that includes a value in a variable that expresses a position in at least one direction in the small region, expresses an equivalent material constant for a region that is a portion of a small region, and using the function, calculates an equivalent material constant for the small region with respect to the at least one direction.

Equivalent material constant calculation system, storage medium storing an equivalent material constant calculation program, equivalent material constant calculation method, design system, and structure manufacturing method

Growing community of inventors

Sanda, Japan

Yutaka Kumano