Shinkawa Ltd.

Preferred Robotics, Inc.

Yutaka Kondo

Junichi Abe

Kohei Seyama

Kenichi Hidai

Shigeru Hayata

Osamu Kakutani

Koji Terada

Hisashi Ueda

An autonomous vehicle includes one or more sensors configured to obtain one or more images of a conveyance target that includes one or more markings; and a controller configured to control the autonomous vehicle. The controller includes one or more processors, and one or more memories storing one or more programs, which when executed, cause the one or more processors to identify the conveyance target based on a recognition result of the one or more markings included in the one or more images, and control conveyance of the conveyance target by the autonomous vehicle based on an identification result of the conveyance target.

Autonomous vehicle, conveyance object, and control method for autonomous vehicle

The present invention comprises: a spool (); a clamper (); a torch electrode (); a high-voltage power source circuit (); a non-bonding detection circuit (); a first changeover switch () switching a connection between the spool () and the high-voltage power source circuit () or the non-bonding detection circuit (); and a relay () turning on/off a connection between the clamper () and a spool side of the first changeover switch (), and comprises a control part () that sets the first changeover switch () to the high-voltage power source circuit side and turns off the relay () to generate electric discharge, and that sets the first changeover switch () to the non-bonding detection circuit side and turns on the relay () to perform non-bonding detection. Due to this configuration, electric corrosion of a wire clamper can be suppressed and non-bonding detection can be carried out with a simple configuration.

Wire bonding apparatus, circuit for wire bonding apparatus, and method for manufacturing semiconductor device

A bonding apparatus includes: a reference plane; a bonding arm configured to be rotated about a rotation center that is arranged separately from the reference plane and to move a capillary attached at a tip end thereof obliquely toward and away from the reference plane; and an imaging device for optically detecting bonding positions on a semiconductor chip and/or a lead frame, in which an angle between an optical axis being heading for the imaging device from the reference plane and the reference plane is approximately equal to an angle between a motion trajectory of a tip end of the capillary and the reference plane, and thereby the bonding apparatus can have a wide bonding area with a simple mechanism as well as perform high-speed and high-accuracy bonding.

Bonding apparatus and bonding stage height adjustment method for the bonding apparatus

Growing community of inventors

Tokyo, Japan

Yutaka Kondo