Sony Chemicals Corporation

Sony Corporation

Sony Chemical & Information Device Corporation

Yutaka Kaneda

Toshihiro Shinohara

Keiichi Naito

Soichiro Kishimoto

Hiroyuki Hishinuma

Akira Tsutsumi

Yoshio Arimitsu

An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching maskis formed on the bump formation sideof a metal foilhaving a thickness (t+t) equal to the sum of the thickness tof a wiring circuitand the height tof the bumpsto be formed on a wiring circuit, the bumpsare formed by half-etching the metal foilfrom the bump formation etching maskside down to a depth corresponding to a predetermined bump height t, and a metal thin film layercomposed of a different metal from the metal foilis formed on the bump formation side of the metal foil, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Method for manufacturing a bump-attached wiring circuit board

A process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.

Processes for manufacturing multilayer flexible wiring boards

A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 &#x3bc;m are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t+t) which is the sum of a thickness tof a wiring circuit and a height tof bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 &#x3bc;m, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t

Wiring circuit board having bumps and method of producing same

An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask () is formed on the bump formation side () of a metal foil () having a thickness (t+t) equal to the sum of the thickness tof a wiring circuit () and the height tof the bumps () to be formed on a wiring circuit (), the bumps () are formed by half-etching the metal foil () from the bump formation etching mask () side down to a depth corresponding to a predetermined bump height tand a metal thin film layer () composed of a different metal from the metal foil () is formed on the bump formation side of the metal foil (), thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching maskis formed on a bump-forming surfaceof a metal foilwhich has a thickness that is the sum of the thickness tof the wiring circuitand the height tof the bumpswhich are to be formed on the wiring circuit(tt), and then the bumpsare formed by half-etching the metal foilto a depth corresponding to the desired bump height tfrom the bump-formation etching maskside, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Method for manufacturing wiring circuit boards with bumps and method for forming bumps

An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coatingand a resist filmare formed in this order on the surface of a metal filmand on the surface of each metal bumpformed on the metal film, and a pressure is applied on the surface to depress the resist filmon the metal bump, followed by etching. As the surface of the resin coatingis partially exposed at the depressed portion of the resist film, etching of the resin coatingproceeds from that portion to bulge the surface of the metal bumpfrom the resin coating. If the resist filmis formed after a flexible resin coatingis formed on the rigid resin coating, the flexible resin coatingcan serve as an adhesive layer.

Flexible printed wiring boards

A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 &mgr;m are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t &plus;t ) which is the sum of a thickness t of a wiring circuit and a height t of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 &mgr;m, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t

Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask is formed on a bump-forming surface of a metal foil which has a thickness that is the sum of the thickness t of the wiring circuit and the height t of the bumps which are to be formed on the wiring circuit (t &plus;t ), and then the bumps are formed by half-etching the metal foil to a depth corresponding to the desired bump height t from the bump-formation etching mask side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

A bump formation etching mask is formed on the bump formation side of a metal foil having a thickness (t &plus;t ) equal to the sum of the thickness t of a wiring circuit and the height t of the bumps to be formed on a wiring circuit. The bumps are formed by half-etching the metal foil from the bump formation etching mask side down to a depth corresponding to a predetermined bump height t A metal thin film layer formed of a different metal from the metal foil is formed on the bump formation side of the metal foil, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations, such as plating pretreatments.

Bump-attached wiring circuit board and method for manufacturing same

A semiconductor element mounting interposer is produced by (A) forming a conducting circuit that comprises motherboard connecting electrodes,and plated leads,on an insulating base film,; (B) forming a patterning resin layer,over the conducting circuit,; (C) etching patterning resin layer,so as to expose the motherboard connecting electrodes,and plated leads,; (D) masking plated leads,with an electroplating resist layer,; (E) depositing an electroplated metal layer,over the exposed motherboard connecting electrodes,; (F) removing the electroplating resist layer,; (G) removing the exposed plated leads,through etching; and (H) where the patterning resin layer,is a polyimide precursor layer, bringing about complete imidation of the polyimide precursor layer.

Growing community of inventors

Kanuma, Japan

Yutaka Kaneda