Renesas Electronics Corporation

Renesas Technology Corp.

Hitachi, Ltd.

The Furukawa Electric Co., Ltd.

Renesas Eastern Japan Semiconductor, Inc.

Nippon Telegraph and Telephone Corporation

Hitachi Engineering Co., Ltd.

Renesas Eastern Technology Corp.

Yutaka Hoshino

Shuji Ikeda

Masatoshi Morikawa

Naotaka Hashimoto

Tomoyuki Miyake

Isao Yoshida

Shiro Kamohara

Megumi Kawakami

Fumitaka Nakayama

Tetsuo Uchiyama

Makoto Hatori

Masao Kondo

Akihiko Furukawa

Tetsuya Iida

Satoshi Yamakawa

Tsuyoshi Kawakami

Masayoshi Tsukamoto

Noboru Okada

Tomohiro Ishimura

Hiroki Tanaka

Yoshihiro Arashitani

Kenji Yokomizo

Takeshi Yagi

Naoki Nakagawa

Yasuko Yoshida

Keiichi Yoshizumi

Kyoya Nitta

Shunichi Matsushita

Kazushi Fukuda

Kyoichiro Asayama

Hirotaka Watanabe

Masaki Iwama

Shinya Hamaguchi

Keiichiro Sugimoto

Yuji Aoyagi

Shinichi Niwa

Satoru Haga

Eiji Konda

Eisuke Otani

Yohei Endo

Eri Okamoto

Yukihiko Shibata

Komaki Inoue

Tatsuya Oyama

Koichi Mizuno

Yuuki Koide

A method for manufacturing an intermittent bonding type optical fiber ribbon which is capable of forming non-connection portions and intermittent connection portions between adjacent coated optical fibers formed into an optical fiber ribbon by performing a laser processing for the ribbon through irradiation with a pulse laser light, thereby making it possible to rapidly form the intermittent connection portions and the non-connection portions while maintaining high linear velocity of the coated optical fiber. The non-connection portions and the intermittent connection portions are formed in the obtained intermittent bonding type optical fiber ribbon through the irradiation with the pulse laser light, so the intermittent bonding type optical fiber ribbon becomes the intermittent bonding type optical fiber ribbon, which is capable of securing operability during collective connection and surely being subjected to an intermediate branching without damaging cable characteristics during high density mounting.

Method for manufacturing intermittent bonding type optical fiber ribbon and intermittent bonding type optical fiber ribbon

An optical fiber ribbon is intermittently connected in a length direction by an intermittent connection which includes a polyol having a weight-average molecular weight of 3000 to 4000 in a specific amount relative to the entire intermittent connection and which has Young's modulus at 23&#xb0; C. within a specific range. When collectively unitizing optical fiber ribbons to form an optical fiber cable, an optical fiber ribbon is formed which maintains advantages of the optical fiber ribbon and which prevents cracks of the intermittent connection and detachment of the intermittent connection from a colored optical fiber core when the cable is subjected to repetitive ironing.

Optical fiber ribbon and optical fiber cable

Two bundle materials are provided on the outer periphery of a plurality of optical fibers. The bundle materials are twisted back while reversing the winding from front to back and vice versa to thus wind the bundle materials around the plurality of optical fibers. That is, the bundle materials are not wound spirally around the plurality of optical fibers. The bundle materials are bonded at a bonding portion where both bundle materials intersect. The bonding portion is provided along a center line of an optical fiber unit. The bundle materials are arranged in ranges which are each approximately 180&#xb0; and partitioned by the center line.

Optical fiber unit, optical fiber cable, and method for manufacturing optical fiber unit

An optical fiber cable is a slot-less type optical fiber cable not using a slot, and is provided with: a plurality of optical fiber core wires; a presser-winding member; a linear body; a tension member; a tear cord; a jacket, etc. The presser-winding member is provided to the outer circumference of the optical fiber core wires. A cable core on which the linear body is wound is formed on the outer circumference of the presser-winding member. The linear member wound on the outside of the presser-winding member has a thermal shrinkage of 0.2% or lower at a temperature of &#x2212;40&#xb0; C. to +85&#xb0; C.

Optical fiber cable and optical fiber cable manufacturing method

Optical fiber ribbons each comprise a plurality of optical fiber strands bonded in parallel. In the optical fiber ribbons, adjacent optical fiber strands are bonded by bonding sections that are intermittently bonded at prescribed intervals. The positions of the bonding section for all optical fiber ribbons are mutually offset in the longitudinal direction. In other words, the longitudinal-direction positions of the bonding section for the optical fiber ribbons never exactly match.

Optical fiber cable

An indoor cable is composed of an optical fiber core, tension members, an outer sheath, and so forth. The optical fiber core and the tension members are integrated by the outer sheath. The outer sheath is composed of a transparent material. The optical fiber core includes a glass wire and a resin coating (a primary resin layer and a secondary resin layer). The optical fiber core does not have a colored layer that is conventionally formed on the outer periphery of the resin coating layer. That is, the optical fiber core is composed entirely of transparent materials. On both sides of the optical fiber core, separate from the optical fiber core, is arranged a pair of tension members. The tension members are composed of transparent materials.

Indoor cable used as optical fiber cable

An optical fiber ribbon comprises a plurality of optical fiber strands that are arranged side-by-side in one direction and integrated. The optical fiber ribbon comprises a plurality of optical fiber strands that are bonded in parallel. In the optical fiber ribbon, the adjacent optical fiber strands are bonded using a bonding section in which the same are continuously bonded along the entire length thereof and a bonding section in which the same are intermittently bonded at prescribed intervals. In other words, either of the bonding sections is formed between the adjacent optical fiber strands.

Loose tube-type optical fiber unit

A semiconductor device has a first element region, a second element region, and a first isolation region in a thin film region and a third element region, a fourth element region, and a second isolation region in a thick film region. It is manufactured with step (a) of providing a substrate having a silicon layer formed via an insulating layer, step (b) of forming element isolation insulating films in the silicon layer in the first isolation region and the second isolation region of the substrate step (c) of forming a hard mask in the thin film region, step (d) of forming silicon films over the silicon layer exposed from the hard mask in the third element region and the fourth element region, and step (e) of forming element isolation insulating films between the silicon films in the third element region and the fourth element region.

Semiconductor device having semiconductor layers with different thicknesses

The reliability of a semiconductor device including a MOSFET formed over an SOI substrate is improved. A manufacturing method of the semiconductor device is simplified. A semiconductor device with n-channel MOSFETsQn formed over an SOI substrate SB includes an n-type semiconductor region formed as a diffusion layer over an upper surface of a support substrate under a BOX film, and a contact plug CTelectrically coupled to the n-type semiconductor region and penetrating an element isolation region, which can control the potential of the support substrate. At a plane of the SOI substrate SB, the n-channel MOSFETsQn each extend in a first direction, and are arranged between the contact plugs CTformed adjacent to each other in the first direction.

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor device having semiconductor layers with different thicknesses

An optical fiber cable enabling further reduction of possibilities of disconnection of optical fiber due to, for instance, cicada oviposition. The optical fiber cable () is provided with: an optical fiber core (); a tension member (), which is arranged in parallel to the optical fiber core () on one side or on the both sides of the optical fiber core (); and a sheath () which integrally covers the optical fiber core () and the tension member (). At least one portion of the sheath () is composed of a polymeric material having a yield point stress of 12 MPa or higher.

An optical fiber cable which is suitably set in a conduit by pushing the optical fiber cable into the conduit so as to insert the optical fiber cable through the conduit and which does not reduce the ease of manufacture and the mechanical characteristics of the optical fiber cable. The optical fiber cable includes an optical fiber cable core wire and a sheath covering the optical fiber cable core wire, wherein a dynamic friction coefficient between a surface of the sheath of the optical fiber cable and a surface of a sheath of another optical fiber cable is 0.17 to 0.34, and a dynamic friction coefficient between the surface of the sheath of the optical fiber cable and a surface of a sheet composed of polyvinyl chloride is 0.30 to 0.40.

Optical fiber cable having a sheath and for setting in a conduit

In order to realize a wider bandwidth of a frequency characteristic of a power amplification circuit, outputs of differential push-pull amplifiers which are matched at respectively different frequencies are combined together by secondary inductors, and the combined signal is outputted.

Power amplification circuit having transformer

In a high frequency amplifying MOSFET having a drain offset region, the size is reduced and the on-resistance is decreased by providing conductor plugs(P) for leading out electrodes on a source region, a drain regionand leach-through layers(), to which a first layer wirings(M) are connected and, further, backing second layer wiringstoare connected on the conductor plugs(P) to the first layer wirings(M).

Semiconductor device including a power MISFET

Growing community of inventors

Akishima, Japan

Yutaka Hoshino