Toshiba Lighting & Technology Corporation

Kabushiki Kaisha Toshiba

Yutaka Honda

Masahiro Izumi

Tomohiro Sanpei

Yumiko Hayashida

Kiyoshi Otani

Takayoshi Moriyama

Kazunari Higuchi

Shinichi Kumashiro

Kenji Nezu

Shinji Nogi

Sumio Hashimoto

According to one embodiment, a lighting apparatus includes a main body including a flat thermal conduction surface. The thermal conduction surface contacts a back surface of a board. Light-emitting devices are mounted on a front surface of the board. An optical member is opposed to a peripheral part of the board on the front surface side of the board. The optical member is fastened to the main body by fastening members, to push the peripheral part of the board against the heat conduction surface of the main body.

Lighting apparatus

A lighting apparatus is provided with a plurality of light-emitting devices, a substrate, a blind member, and a reflector. The reflector is formed with a plurality of reflective surfaces corresponding to the light-emitting devices, individually. The shielding angle at which light emitted from that one of the light-emitting devices which is located on the outermost periphery is intercepted by the reflective surface corresponding to the outermost light-emitting device is greater than shielding angles at which light emitted from the light-emitting devices located inside the outermost light-emitting device is intercepted by the reflective surfaces corresponding to the inside light-emitting devices.

An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Illumination device with semiconductor light-emitting elements

Growing community of inventors

Yokohama, Japan

Yutaka Honda