Denki Kagaku Kogyo Kabushiki Kaisha

Tokyo Electron Limited

Yutaka Hirashima

Kei Isozaki

Akira Koshiishi

Masahiko Matsudo

Yoshitaka Taniguchi

Akira Miyai

Yasuo Imamura

Takeshi Gotoh

Nobuyuki Yoshino

Isao Sugimoto

Katsunori Terano

Yasuhito Hushii

Syoji Takakura

Yoshihiko Tujimura

A circuit substrate which has a ceramic substrate and an Al circuit comprising Al or an Al alloy bonded to said ceramic substrate via a layer comprising Al and Cu.

Circuit substrate

A heat-resistive electrode material substantially consisting of 40 to 60 wt % of at least one of ZrB.sub.2 and TiB.sub.2, 20 to 50 wt % of BN, and not more than 30 wt % of AlN is disclosed. This heat-resistive electrode material is used in at least portions of electrodes of an apparatus having a plasma generating unit, e.g., an ion source, a plasma etching apparatus, or a plasma CVD apparatus, that contacts a plasma.

Heat-resistant electrode material, electrode using the same, and

A chromium carbide sintered body having high toughness contains 99.5 to 50% by weight of chromium carbide and 0.5 to 50% by weight of AlN. The sintered body contains acicular crystals of chromium carbide.

Chromium carbide sintered body

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Omuta, Japan

Yutaka Hirashima