Fuji Electric Co., Ltd.

Nippon Light Metal Company, Ltd.

Yutaka Hirano

Tomoyuki Hirayama

Hiromichi Gohara

Ryoichi Kato

Kohei Yamauchi

Eiji Anzai

Takumi Nakamura

Etsuro Kubota

A heat sink includes a base plate; a cover overlapping the base plate; fins, each having a plate-like shape projecting from the base plate in a direction perpendicular to the base plate, located between the base plate and the cover; one or a plurality of first fin groups composed of a plurality of the fins arranged with a gap therebetween in a first direction; and one or a plurality of second fin groups composed of a plurality of the fins arranged with a gap therebetween in the first direction, and adjacent to the first fin group with a gap therebetween in a second direction. Positions in the first direction of the fins belonging to the second fin group are displaced with respect to positions in the first direction of the fins belonging to the first fin group. Each of the fines has an S-shape.

Heat sink

To provide a method for manufacturing a power device cooler, which not only can accomplish cost reduction and preferable joining between the cooler and a heating element equipped with a power device but also can improve the productivity. After first and second cases and fins that constitute a cooler are brazed by means of a non-corrosive flux and a brazing filler material, the first and second cases and the fins being made of aluminum, flux residues that are attached at least to a heat receiving surface of the first and second cases that is to be joined to a heating element equipped with a power device, are removed by a wet blasting method in which a mixture of an abrasive formed of polygonal alumina particles having a median particle diameter of 4 to 250 &#x3bc;m and a liquid is projected onto the heat receiving surface by compressed air.

Method for manufacturing power device cooler

Growing community of inventors

Shizuoka, Japan

Yutaka Hirano