Taiyo Yuden Co., Ltd.

Tokyo Medical and Dental University

Yutaka Hata

Masashi Miyazaki

Yuichi Sugiyama

Hideki Yokota

Tatsuro Sawatari

Hiroyuki Kobayashi

Hiroyuki Kagechika

Yoshiki Hamada

Shigeru Ito

Kentaro Nakagawa

Masashi Katakai

Provided is a circuit board including: a metal core layer having a first main surface capable of supporting a mounting component and a second main surface which is opposite to the first main surface; a first exterior coating base material which is arranged facing the first main surface; and a second exterior coating base material which is arranged facing the second main surface and includes a heat dissipation layer having a via which is connected to the second main surface.

Circuit board and circuit module

A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other

Multilayer board and manufacturing method of the same

A circuit board includes a flexible wiring board having a first section in one end and a second section next to the first section in a plan view; a plate-shaped reinforcing member embedded in the flexible wiring board in the first section; and a first multilayer wiring layer on a top surface of the flexible wiring board in the first section, the first multilayer wiring layer having an opening that exposes a portion of a top surface of the reinforcing member for mounting a device thereon.

The invention provides a novel myogenesis promotor, a novel muscle atrophy inhibitor, a novel composition or a novel TAZ activator. The myogenesis promotor, the muscle atrophy inhibitor, the composition and the TAZ activator include a composition represented by the following Formula (I) as an active ingredient. In Formula (I), Rrepresents a hydrogen atom or an alkyl group; Rrepresents an aryl group, a heterocyclic group, an alkyl group or the like; Rrepresents &#x2014;NRRor &#x2014;N&#x2550;C&#x2014;R; each of Rand Rindependently represents a hydrogen atom, an alkyl group or the like; Rrepresents &#x2014;NRR, an aryl group or a heterocyclic group; Rrepresents a hydrogen atom, an alkyl group or the like; Rrepresents a hydrogen atom, an alkyl group or the like; each of Rand Rindependently represents a hydrogen atom, an alkyl group or the like; Rrepresents a cyano group or &#x2014;C(&#x2550;O)R; and Rrepresents an aryl group, a heterocyclic group, an alkyl group or the like. 

Myogenesis promotor, muscle atrophy inhibitor, medical composition and TAZ activator

A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.

Circuit board

A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape and is disposed closer to one of the pair of the wiring layers than to another of the pair of the wiring layers in a vertical direction.

Provided is a module substrate including an inductor that can be made thinner and smaller. A module substrate according to an aspect of the present invention includes a substrate member having a mounting surface on which electronic components are mounted, a magnetic core disposed within the substrate member, and a conductor coil provided in the substrate member and wound around the magnetic core. The module substrate has a configuration in which an inductor is built into the substrate member, which makes it possible to make the overall module substrate smaller and thinner.

Module substrate

An embedded component substrate includes: a core layer; a first electrode provided on a top surface of the core layer with a first insulating layer therebetween; and a second electrode provided on a bottom surface of the core layer with a second insulating layer therebetween, wherein a cavity is formed in the embedded component substrate from a top surface thereof to expose the second insulating layer at a bottom of the cavity, wherein a placement region is defined on the bottom of the cavity, for accommodating an electronic component; and wherein the embedded component substrate further includes a pad electrode on a portion of the second insulating layer, exposed by the cavity, surrounding the placement region located on the bottom of the cavity, the pad electrode vertically protruding from a top surface of the exposed second insulating layer upwardly and being configured to electrically connect to the electronic component.

Embedded component substrate with a metal core layer having an open cavity and pad electrodes at the bottom of the cavity

A composite substrate has a rigid substrate that includes: a core layer, a first laminated layer on a first surface of the core layer, and a second laminated layer on a second surface of the core layer, the rigid substrate having a cutout in the core layer and the second laminated layer on one side face of the rigid substrate; and a flexible substrate inserted into the cutout in the rigid substrate on the one side face and laterally and externally protruding from the one side face of the rigid substrate, wherein the rigid substrate has opposing walls each constituted of the second laminated layer and the core layer erected on the first laminated layer to define inner side faces, respectively, of the cutout so as to accommodate the flexible substrate in a direction perpendicular to a direction in which the side face of the rigid substrate extends.

Composite substrate and rigid substrate

In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion.

Camera module

The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.

Method of manufacturing substrate having cavity

A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.

An electronic component to be embedded in a substrate is configured so that planar coils protected by insulators are sandwiched be a pair of magnetic layers. Ports, or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers, and the predetermined positions correspond to the positions opposite to terminal electrodes of the planar coils. Accordingly, a contribution to reduction of the size and weight of electronic equipment can be made.

Growing community of inventors

Tokyo, Japan

Yutaka Hata