Senju Metal Industry Co., Ltd.

Thine Electronics, Inc.

Yutaka Chiba

Koji Watanabe

Shunsaku Yoshikawa

Shinichi Nomoto

Tsukasa Ohnishi

Yoshie Yamanaka

Hiroki Ishikawa

Seiko Ishibashi

The embodiment relates to an input device comprises first and second MOS transistors, first to fourth resistors, and a comparator circuit. The first MOS transistor has a drain connected to a first terminal having a first voltage, a gate connected to a signal input terminal, and a source connected to a second terminal having a second voltage via the first and third resistors. The second MOS transistor has a drain and a gate connected to the first terminal, and a source connected to the second terminal via the second and fourth resistors. The comparator circuit outputs a signal having a level corresponding to a state in which a voltage of a node between the first and third resistors is higher or lower than a voltage of a node between the second and fourth resistors.

Input device which outputs a signal having a level corresponding to a state in which a voltage value of an input signal is higher or lower than a threshold value

A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy contains Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.

Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part

To prevent the breakage of the joint between a ceramic substrate and a glass epoxy substrate. The copper column is formed by a wiredrawing step for drawing a copper wire formed linearly to a predetermined diameter; a cutting step for cutting the copper wire, which has been drawn in the wire drawing step, in a predetermined length; a pressing step for pressing one end of the copper wire, which has been cut in the cutting step, in a longitudinal direction to form a copper column member; and an annealing step for annealing the copper column member, which has been formed in the pressing step, by maintaining a heating period of 60 minutes or longer at 600&#xb0; C. or higher. Thereby, the Vickers hardness of the copper column becomes is 55 HV or less and the copper column is softened. Therefore, when joining the ceramic substrate and the glass epoxy substrate through the copper column, heat stress caused by a difference between the thermal expansion of the ceramic substrate and the thermal expansion of the glass epoxy substrate can be absorbed by the copper member. As a result, the breakage of the joint between the ceramic substrate and the glass epoxy substrate can be prevented.

Copper column

Growing community of inventors

Tokyo, Japan

Yutaka Chiba