Tokyo Electron Limited

Canon Finetech Nisca Inc.

Nisca Corporation

Yutaka Akaike

Isao Kono

Haruhiko Yoshioka

Hiroyuki Nakayama

Shigeru Kasai

Satoshi Sano

Chiaki Mochizuki

Hiroshi Yamada

Shinji Iino

Masaru Suzuki

Tomoya Endo

Munetoshi Nagasaka

Yoshinori Fujisawa

Yasuhito Yamamoto

Yoshiyasu Kato

Dai Kobayashi

Takeo Saito

Shinya Kuroda

Hiroaki Komiya

A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.

Dummy wafer

A sheet punching apparatus includes a waste box formed of insulating resin, a detection sensor provided in the waste box and configured to detect the amount of paper chips in the waste box, and a conductive member disposed such that at least a part thereof is positioned in midair in the waste box below the detection sensor. With this configuration, erroneous detection of the detection sensor can be prevented.

Sheet punching apparatus

An inspection apparatus is provided to inspect an imaging device formed on an inspection object by bringing a contact terminal into electrical contact with a wiring layer of the imaging device while causing light to enter the imaging device. The light enters the imaging device from a back surface that is a surface on the side opposite to the side on which the wiring layer is formed. The inspection apparatus includes a substrate support made of a light-transmissive material and on which the inspection object is supported such that the substrate support faces a back surface of the imaging device, and a light irradiation mechanism disposed to be opposite to the inspection object with the substrate support interposed therebetween and having a plurality of LEDs such that light from the LEDs is oriented toward the inspection object.

Inspection apparatus

There is provided a wafer inspection device that is capable of bringing a polishing wafer into proper contact with probes without lowering throughput. The total value T of a thickness tof a polishing plate, a thickness tof a polishing wafer and a magnitude textending from a lower surface of a main body of a pogo frame to a lower end of each probe of a probe card is set to be larger than a magnitude tof a lip seal protruding from an upper surface of a chuck top.

Wafer inspection device and maintenance method for same

A punching apparatus, including: a punching portion configured to punch a sheet; and a chad box configured to store a chad of a sheet punched by the punching portion, wherein the chad box includes: a first inner wall portion formed of an insulator; and a second inner wall portion formed of a conductor and arranged above the first inner wall portion.

Punching apparatus

A substrate inspection apparatus includes a mounting table, an inspection unit, a temperature control unit and a medium channel. The mounting table mounts thereon a substrate on which a semiconductor device is formed. The inspection unit inspects electrical characteristics of the semiconductor device on the mounted substrate. The temperature control unit controls a temperature of the mounting table. The medium channel passes through the mounting table. The temperature control unit includes a high-temperature medium supply unit supplies a high-temperature medium to the medium channel, a low-temperature medium supply unit supplies a low-temperature medium to the medium channel and a medium mixing unit mixes the high-temperature medium and the low-temperature medium which are supplied to the medium channel.

Substrate inspection apparatus and substrate temperature control method

A mounting apparatus includes a surface plate; a temperature control unit integrated with the surface plate; and a bottom plate integrated with the temperature control unit via a heat insulation ring, wherein a temperature of a target object held on the surface plate is capable of being controlled and the surface plate is formed of ceramic. The surface plate and the temperature control unit are coupled to each other by a first coupling member at each portion thereof except for each peripheral portion thereof such that the peripheral portion of the surface plate being not coupled thereto. The peripheral portion of the temperature control unit is coupled to the heat insulation ring by a second coupling member.

Ceramic mounting for wafer apparatus with thermal expansion feature

A transfer mechanism for a target object includes at least two insulating wire materials disposed spaced from each other to transverse a mounting table, at least two pairs of supporting bodies horizontally disposed at outsides of the mounting table, for stretching said at least two wire materials in parallel with a mounting surface of the mounting table, and at least two grooves formed on the mounting surface of the mounting table to respectively receive therein said at least two wire materials by said at least two pairs of supporting bodies. The transfer mechanism further includes a first elevation driving mechanism for vertically moving said wire materials between said grooves and above of the mounting surface through said pairs of supporting bodies, wherein the target object is transferred between a carrying mechanism and the mounting table through said at least two wire materials.

Transfer mechanism for target object to be inspected

A test device includes a movable mounting table having a temperature controlling mechanism therein; a probe card provided with a plurality of probes positioned above the mounting table; and a first temperature control unit for controlling the temperature controlling mechanism so that a target object on the mounting table can be heated to a predetermined temperature to test electrical characteristics of the target object. The mounting table is provided with a heater facing a plurality of probes protruding from the mounting table in the high-temperature test on the target object.

Test device

A substrate supporting unit includes a supporter for supporting a substrate, and a temperature controller for controlling the supporter. The supporter includes liquid supply openings opened at a top surface of the supporter. A liquid is supplied between the substrate and the supporter through the liquid supply opening. Liquid discharge grooves are formed in the top surface of the supporter near the liquid supply openings, and the liquid between the substrate and the supporter is discharged through the liquid discharge grooves. Liquid discharge openings are opened in the liquid discharge grooves, and the liquid is discharged through the liquid discharge openings. Further, the supporter includes exhaust grooves formed in the top surface of the supporter and exhaust openings opened in the exhaust grooves, the exhaust grooves and the exhaust openings also serving as the liquid discharge grooves and the liquid discharge openings, respectively.

Substrate supporting unit, and substrate temperature control apparatus and method

An image reading apparatus enables designs of such apparatus without regard to a grounding location for a guide shaft and reduces the number of assembly hours and fastening members to fasten a ground member of a guide shaft to a frame. An apparatus includes a scanning unit for scanning and reading images on originals placed on a platen; a guide shaft supporting and guiding the scanning unit in a sub-scanning direction; a shaft support unit supporting an end of the guide shaft; and a plastic frame housing the scanning unit and guide shaft and formed with the shaft support unit, wherein the guide shaft is grounded via the shaft support unit.

Image reading apparatus

A rotating mechanism according to the present invention is a mechanism for reversibly rotating a chuck top , on which a wafer to be inspected is mounted. The rotating mechanism is provided with a linearly driving mechanism arranged on one side of the chuck top , a nut which is linearly moved by the linearly driving mechanism, a guide rail A for linearly guiding the nut , and a link mechanism for coupling the nut , which moves along the guide rail A, to the chuck top

Drivingly rotatable mechanism of specimen loading table and specimen loading mechanism

An aligner (,) according to the present invention is an apparatus in which a wafer chuck (,), wafer (W), and contactor (,) are aligned with one another, and these three elements are then united to form a shell (S), and the shell (S) is reduced to the three elements. A identification code (,) is attached to the contactor (,). A reader (,) reads the identification code (,). The identification code (,) read by means of the reader (,) is associated with the position of the main chuck (,) reached when first and second valve mechanisms (,) are connected, and is loaded into a control device (,). When the shell (S) is disassembled, the position of the main chuck (,) is retrieved in the control device (,) in accordance with the identification code (,) read by means of the reader (,). The main chuck (,) is moved according to the result of the retrieval.

Aligner

An aligner according to the present invention is constituted by integrating a wafer chuck, a wafer and a contactor, which are aligned with one another, into one piece by vacuum adsorptivity. A vacuum exhaust apparatus for generating the vacuum adsorptivity, includes first and second valve mechanisms, a valve operation mechanism for opening/closing these valve mechanisms, first and second solenoid valves connected to the valve operation mechanism through a vacuum exhaust line, and a vacuum leak detecting pressure gauge interposed between the first solenoid valve and the valve operation mechanism.

Aligner and method for inspecting semiconductor wafer using shell

A probe apparatus comprising an apparatus body fitted with a probing card having a probe connected electrically with an electrode of an object of inspection, a test head operatively mounted on the apparatus body and electrically continuous with the probe of the probing card, rotating mechanism for rotating the test head, and vertical moving mechanism for vertically raising or lowering the test head.

Growing community of inventors

Nirasaki, Japan

Yutaka Akaike