Rohm Co., Ltd.

Yuta Yokotsuji

Masatoshi Aketa

The semiconductor device of the present invention includes a first conductivity type semiconductor layer made of a wide bandgap semiconductor and a Schottky electrode formed to come into contact with a surface of the semiconductor layer, and has a threshold voltage Vof 0.3 V to 0.7 V and a leakage current Jof 1×10A/cmto 1×10A/cmin a rated voltage V.

Semiconductor device

The semiconductor device of the present invention includes a first conductivity type semiconductor layer made of a wide bandgap semiconductor and a Schottky electrode formed to come into contact with a surface of the semiconductor layer, and has a threshold voltage Vof 0.3 V to 0.7 V and a leakage current Jof 1&#xd7;10A/cmto 1&#xd7;10A/cmin a rated voltage V.

The semiconductor device of the present invention includes a first conductivity type semiconductor layer made of SiC, a Schottky electrode formed to come into contact with at least a portion of a surface of the semiconductor layer, a field region surrounding the Schottky electrode, an annular trench formed on the field region and surrounding the Schottky electrode and a second conductivity type layer formed under a portion of the Schottky electrode outside at least the portion of the surface of the semiconductor layer.

A semiconductor device of the present invention includes a semiconductor layer made of a wide bandgap semiconductor and a Schottky electrode being in contact with a surface of the semiconductor layer. The semiconductor layer includes a drift layer that forms the surface of the semiconductor layer and a high-resistance layer that is formed on a surface layer portion of the drift layer and that has higher resistance than the drift layer. The high-resistance layer is formed by implanting impurity ions from the surface of the semiconductor layer and then undergoing annealing treatment at less than 1500&#xb0; C.

Wide band-gap semiconductor device including schotky electrode and method for producing same

The semiconductor device of the present invention includes a semiconductor layer made of a wide bandgap semiconductor, a trench that is selectively formed on a surface portion of the semiconductor layer and that defines a unit cell having a predetermined shape on the surface portion, and a surface electrode that is embedded in the trench so as to cover an upper surface of the unit cell and that forms a Schottky junction between the unit cell and the surface electrode, and side surfaces of the trench are formed of only a plurality of planes that have plane orientations crystallographically equivalent to each other.

Growing community of inventors

Kyoto, Japan

Yuta Yokotsuji