Nitto-denko Corporation

Yuta Shimazaki

Hakaru Horiguchi

Kosuke Yonezaki

Kunimasa Mishima

Fumiteru Asai

Eiichi Imoto

Tomokazu Takahashi

Takashi Habu

Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. In the protection method, a protective sheet having a substrate and a PSA layer provided to at least one face of the substrate is applied for protection via the PSA layer to a Low-E glass plate having a Low-E layer that comprises a zinc component. The method is characterized by using the protective sheet wherein the PSA layer is formed from a water-dispersed PSA composition and includes less than 850 μg ammonia per gram of PSA layer weight.

Method for protecting low-E glass plate, method for producing glass unit, laminate and protective sheet for low-E glass plate

Provided is a Low-E glass plate protective sheet that can have protective properties for a Low-E glass plate as an object to be protected and can maintain good removability while preventing or inhibiting surface contamination of the object to be protected even when prolongedly adhered thereto. The Low-E glass plate protective sheet is provided. The protective sheet has a PSA layer. The PSA layer comprises at least 95% base polymer by weight.

Protective sheet

Provided is a method for preparing a PSA composition for protecting Low-E glass plates from degradation and corrosion. A PSA composition preparation method is provided for Low-E glass plate protection. The method comprises a step of obtaining an aqueous liquid, and a step of obtaining a polymer containing liquid comprising the aqueous liquid and a polymer. Here, the aqueous liquid satisfies at least (a) having an electrical conductivity below 300 μS/cm or (b) having a chloride ion concentration below 35 μg/mL.

Method for preparing pressure-sensitive adhesive composition, method for producing protective sheet and method for producing glass unit

To provide a method for protecting a Low-E glass plate, the method being capable of preventing or inhibiting alteration of Low-E layers. Provided is a Low-E glass plate protection method. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes an adsorbent capable of adsorbing ammonia.

Method for protecting low-E glass plate, method for producing glass unit and protective sheet for low-E glass plate

Provided is a Low-E glass plate protection method capable of preventing or inhibiting alteration and erosion of Low-E layers. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a tin component. Here, the Low-E layer comprises a tin component. The protective sheet has a PSA layer. The PSA layer comprises a phosphorus compound having a P—OR group. Here, R is a hydrogen atom or an organic group.

Low-E glass plate, protective sheet for low-E glass plate and use thereof

Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes ammonia and an acid or acid salt capable of forming a counterion to an ammonium ion.

Method for protecting Low-E glass plate, method for producing glass unit, laminate and protective sheet for Low-E glass plate

The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.

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Ibaraki, Japan

Yuta Shimazaki