Tokyo Electron Limited

Yuta Nishiyama

Akihiro Teramoto

Shinichi Hatakeyama

Yuichiro Kunugimoto

Shota Ueyama

Tomoki Okazawa

Takeshi Tobimatsu

A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

Liquid amount measuring method and computer-readable recording medium

Substrate processing system, liquid amount measuring method, computer-readable recording medium, and measuring jig

A liquid processing apparatus includes a processing liquid supply including a nozzle configured to discharge a processing liquid; a nozzle mover configured to move the nozzle between a coating position and a standby position; a suction unit including a suction opening toward a leading end surface of the nozzle located at the standby position; a cleaning unit configured to clean the leading end surface of the nozzle located at the standby position with a cleaning liquid; and a control device. The control device controls the processing liquid supply to discharge the processing liquid in a state that the nozzle is located at the standby position. The control device controls the suction unit to suck the processing liquid. The control device controls the cleaning unit to supply the cleaning liquid toward the standby position to clean the nozzle. The control device controls the suction unit to suck the cleaning liquid.

Liquid processing apparatus and liquid processing method

Growing community of inventors

Koshi, Japan

Yuta Nishiyama