Murata Manufacturing Co., Ltd.

Jfe Steel Corporation

Yuta Morimoto

Yoshihito Otsubo

Issei Yamamoto

Norio Sakai

Tadashi Nomura

Akio Katsube

Hideo Nakagoshi

Akihiro Fujii

Naoya Hayakawa

Yoshihisa Masuda

Minoru Komiyama

Naoya Murakita

Yoriyuki Matsumoto

Hiroaki Tsuchida

Yukuya Tamura

An antenna-attached substrate according to the present disclosure includes a substrate layer, a lower antenna element that is disposed in the substrate layer, an antenna-holding layer that is stacked on an upper surface of the substrate layer, and an upper antenna element that is disposed in the antenna-holding layer and that faces an upper surface of the lower antenna element. The antenna-holding layer is composed of a dielectric material having a relative dielectric constant lower than that of the substrate layer. A lower surface, a side surface, and an upper surface of the upper antenna element are covered by the antenna-holding layer.

Antenna-attached substrate and antenna module

A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

Ceramic electronic component

A radio frequency module in which the loop shape of a wire can be stable by disposing a protruding electrode at a bonding ending-point portion when a bonding wire forms a shield between components is provided. A radio frequency module includes a multilayer wiring board, components to mounted on an upper surface of the multilayer wiring board, a shield member formed of a plurality of bonding wires to cover the component, and a protruding electrode provided at a bonding ending-point portion of each of the bonding wires. Since the protruding electrode is provided at the bonding ending-point portion of each of the bonding wires, undesired bending can be prevented on a second bond side of the bonding wire. The shield member to cover side surfaces and a top surface of the component can be easily formed.

Radio frequency module

The present disclosure enables a component to operate stably by making it unlikely that the component will be affected by unwanted electromagnetic waves generated by another component. A module includes: a substrate; a first component and a second component that are mounted on one main surface of the substrate; a sealing resin layer that seals the first component and the second component; and a shield layer that covers part of the sealing resin layer. A recess is formed in the sealing resin layer toward the one main surface from a surface including an upper surface of the sealing resin layer between the first component and the second component in a plan view from a direction perpendicular to the one main surface. The shield layer is not provided in the recess of the sealing resin layer.

Module having sealing layer with recess

A high-frequency module () includes a multilayer wiring substrate (), a plurality of components () mounted on an upper surface () of the multilayer wiring substrate (), a sealing resin layer () laminated on the upper surface () of the multilayer wiring substrate () and sealing the plurality of components (), and a shield (). The shield () is composed of shield walls () arranged in grooves () and (), respectively, formed between the first component () and the second component () in the sealing resin layer () and a connecting conductor () coupling both the shield walls (). A first region () and a second region () in the sealing resin layer () split by the shield () are contiguous at the location of the connecting conductor () as seen from a direction perpendicular to the upper surface () of the multilayer wiring substrate ().

High-frequency module

A high frequency moduleincludes a wiring board, multiple componentstomounted on an upper surfaceof the wiring board, a shield componentmounted between the componentand the component, a sealing resin layerthat covers the componentstoand the shield component, and a shield filmthat covers the surface of the sealing resin layer. A recessis formed in an upper surfaceof the sealing resin layerso as to expose the shield component. The recessis formed within a region surrounded by edges of the sealing resin layerso as not to reach the side surfaces of the sealing resin layer. The shield filmfurther covers wall surfacesof the recessand part of the shield componentexposed through the recess

High frequency module

The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.

Growing community of inventors

Kyoto, Japan

Yuta Morimoto