The Furukawa Electric Co., Ltd.

Yuta Ishige

Etsuji Katayama

Toshio Kimura

Naoki Hayamizu

Hajime Mori

Atsushi Oguri

Maiko Ariga

Masaki Iwama

Jun Miyokawa

Tetsuya Matsuyama

Masakazu Yoshihara

Masaya Nakazumi

Gabor Gajdatsy

A light emitting apparatus includes: a light emitting element configured to emit laser light; a case configured to house the light emitting element, and including a window configured to allow transmittance of the laser light emitted from the light emitting element; a first optical element provided outside the case and configured to converge, in a fast axis direction, the laser light passing through the window; and a second optical element configured to collimate the laser light input via the first optical element, in the fast axis direction, in a state where a beam width in the fast axis direction is narrower than a beam width in the fast axis direction on an incident surface of the first optical element, the second optical element being located closer to the first optical element than a convergence point of the laser light in the fast axis direction by the first optical element.

Light emitting apparatus, light source unit, light source apparatus, and optical fiber laser

A semiconductor laser module that can increase output of an optical fiber laser is provided. The semiconductor laser module includes: a mounted-base member having a mounted-base face; a plurality of semiconductor laser elements installed on the mounted-base face of the mounted-base member; a lens that collimates laser light emitted from the semiconductor laser element; a condensing lens that condenses the laser light; and an optical fiber to which the condensed laser light is optically coupled, and further includes: between the condensing lens that condenses the laser light and the lens that collimates laser light emitted from the semiconductor laser element, an aperture that restricts light in a slow axis direction of the laser light.

Semiconductor laser module

A semiconductor laser module includes a semiconductor laser device that outputs laser light; an optical fiber that includes a core portion and a cladding portion formed at an outer periphery of the core portion and that receives the laser light from one end and guides the laser light to the outside of the semiconductor laser module; an optical part disposed at an outer periphery of the optical fiber, having optical transmittance at a wavelength of the laser light, and that fixes the optical fiber; a first fixative that fixes the optical part and the optical fiber; and a housing that accommodates the semiconductor laser device and the one end of the optical fiber that receives the laser light, wherein an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part.

A laser device that is easily assembled and can be manufactured at low cost and a light-source device using the same are provided. The laser device includes a base plate portion, a semiconductor laser element placed on the base plate portion, a lid portion provided on the base plate portion, on which the semiconductor laser element is placed, and including a top plate, and a side wall portion covering a part or all of lateral sides of a space between the base plate portion and the top plate. The top plate is integrally formed with a part or all of the side wall portion.

Laser device and light-source device

A laser device that is easily assembled and can be manufactured at a low cost and a light-source device using the same are provided. The laser device includes a mount member including a mount surface, and a semiconductor laser element placed on the mount surface of the mount member. An upper side and lateral sides of the semiconductor laser element on the mount surface are exposed.

An optical module includes a housing and an optical element that is disposed in the housing and emits light in the housing, in which a partial area of a surface inside the housing serves as a reduced optical reflection area processed so as to absorb the light and have a rough surface.

Optical module

Provided is a laser apparatus and a light source apparatus that can reduce the footprint and realize space-saving. The laser apparatus has a bottom plate; a semiconductor laser element mounted on the bottom plate; and a terminal unit that is provided so as to face upward with respect to the bottom plate and enables external electrical connection.

Laser apparatus and light source apparatus

A drawer structure, etc. of an optical fiber from an optical module is disclosed. An optical fiber drawer structure is configured by a roughly cylindrical passage through which an optical fiber passes being connected to a housing. The passage includes a sleeve connected to an outer periphery of the housing and a lid part connected to a tip side of the sleeve. The interior of the passage (sleeve) is provided with a fixing member to fix the optical fiber to the passage. A reduced diameter part and an expanded diameter part are formed in the lid part.

Optical fiber drawer structure and optical module

Semiconductor lasers are arranged in a plurality of columns. The columns of the respective semiconductor lasers include semiconductor laser installed columns. Reflecting mirrors in the respective semiconductor laser installed columns reflect light in substantially the same axial direction as viewed from above, and constitute beam groups. The beam groups of the respective semiconductor laser installed columns are formed on both sides in a width direction of a housing. That is, the beam groups are configured for each of the semiconductor laser installed columns, and the respective beam groups are formed on mutually different axes as viewed from above.

Semiconductor laser module and semiconductor laser module manufacturing method

A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

An optical module includes a base portion having a top-surface metal layer on a top surface of a base, a semiconductor element on the top-surface metal layer and an optical element optically-coupled to the semiconductor element and bonded to the base with adhesive at a first side surface of the base at a side of the optical element being optically-coupled. A pull-back area is formed on the top surface by disposing a second side surface at the side, of the top-surface metal layer at a retracted position to the first side surface at the side. Between an adhesion area where the base and the optical element are bonded and a mounting portion below an optical-power-outputting surface of the semiconductor element, the top-surface metal layer has an adhesive flow stopping portion formed, by patterning, so as to prevent the adhesive from flowing through the pull-back area to the mounting portion's side.

A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.

A semiconductor laser module includes: a semiconductor laser element emitting a laser light; an optical fiber, into which the laser light emitted from the semiconductor laser element is incident, guiding the laser light; and an optical-fiber-holding unit having a fixing agent and holding the optical fiber, the fixing agent being for fixing the optical fiber. The fixing agent is provided at an area in which a power of a leakage light of the laser light having been incident into the optical fiber and then emitted to outside the optical fiber is low.

A semiconductor laser moduleis mainly composed of a package, a semiconductor laser, lenses, reflecting mirrors, an optical fiber, and the like. The packageis composed of a bottom part and side surfaces. The side surfacesstand erect approximately vertical to the bottom part of the package. In the semiconductor laser module, a plurality of semiconductor laser installation surfacesare formed in a step-like shape. On each semiconductor laser installation surface, a semiconductor laseris installed. A lensis arranged at the anterior (in the emission direction) of the semiconductor laser. Moreover, a lensis arranged further to the anterior. A reflecting mirroris fixed to the side surface, which is provided facing the emission direction of the semiconductor laser.

Growing community of inventors

Tokyo, Japan

Yuta Ishige