Denso Corporation

Yuta Hasebe

Makiko Sugiura

Takahiko Yoshida

Yasuyuki Okuda

Hiroshi Tanaka

Ryonosuke Tera

Yasutoshi Suzuki

Kunio Nanba

Kazunori Mizutori

Masanobu Azukawa

Kouji Kida

Junichi Tanaka

Tadashi Kobayashi

Kenta Iwahana

Toshiki Ito

A centrifugal pump for pressurizing fluid by using centrifugal force has an impeller and a casing. The impeller is operated rotatably by an actuator. The casing houses the impeller. The impeller has blades arranged one after another in a circumferential direction of the impeller, and a passage is defined between the blades adjacent to each other in the circumferential direction. The passage has a linear portion and a curved portion. The linear portion extends linearly and has a uniform cross section. The curved portion is connected to an end of the linear portion, extends as being curved to a radial-outer side of the impeller, and decreases in cross section toward the radial-outer side.

Centrifugal pump

A powder coating system which is provided with a rotating stage which makes a metal cylindrical member rotate while holding its internal circumferential surface, a first booth which covers part of the metal cylindrical member which is held by the rotating stage, and a second booth which holds the first booth. A powder coating introduction nozzle which is provided with a filling port of powder coating and a plurality of powder coating spray ports is provided so that a filling port is positioned at the outside of the second booth and so that the plurality of spray ports can be changed in position in the first booth to face surface parts of the metal cylindrical member. The sprayed powder coating is collected inside the second booth by a flow of air from a blow device and is removed by being sucked up by a powder collector.

Powder coating system

A vibration device separates foreign particles from a semiconductor device, and a suction interface of a suction device covers an opening portion of the semiconductor device. A space connected with a vacuum passage and a communication passage is formed between the semiconductor device and the suction interface. The suction device suctions the space, and fresh air is introduced into the space through the communication passage. As a result, a current of air is generated from the communication passage to the vacuum passage, and foreign particles are suctioned and removed from the space.

System and method for removing foreign particles from semiconductor device

A micro device having a micro system structure includes a protection film disposed on the micro system structure for protecting from a particle. The protection film includes a first protection film having a Vickers hardness equal to or larger than 2500 Hv or a nano indentation hardness equal to or larger than 13.64 GPa. The first protection film has a thickness in a range between 0.1 &#x3bc;m and 30 &#x3bc;m. The protection film has a total stress defined as a product of a film stress and a film thickness, and the total stress is equal to or smaller than 700 N/m.

Micro device having micro system structure and method for method for manufacturing the same

An ultrasonic sensor includes a sending element for sending an ultrasonic wave to an object to be detected, a receiving portion for receiving the ultrasonic wave reflected by the object, an oscillating portion that oscillates by the ultrasonic wave transmitted thereto, and a supporting portion for holding an end part of the oscillating portion. The receiving portion is exposed to a space where the object exists. The receiving portion and the oscillating portion are connected through the supporting portion such that the ultrasonic wave received by the receiving portion is transmitted to the oscillating portion through the supporting portion. The oscillating portion is separate from the receiving portion by the supporting portion.

Ultrasonic sensor

A sensor attachment structure includes a sound receiving member for receiving an ultrasound, an ultrasonic sensor attached to the sound receiving member. The ultrasonic sensor includes a semiconductor substrate having first and second surfaces opposite to each other and a substrate recess portion recessed from the first surface of the semiconductor substrate so as to form a membrane in the semiconductor substrate. Furthermore, a cap member is located between the sound receiving member and the semiconductor substrate to cover the second surface of the semiconductor substrate. In addition, the cap member has a first surface bonded to the sound receiving member, and a second surface that is bonded to the second surface of the semiconductor substrate at an outer periphery section of the membrane while having a gap between the cap member and the membrane.

Sensor attachment structure and ultrasonic sensing device

An ultrasonic wave generating device includes a substrate, a heat insulation layer on the substrate, a membrane heating portion on the heat insulation layer, and a membrane oscillator on the heating portion. The heating portion is electrically driven with a predetermined period, and produces heat for thermally displacing a surface of the oscillator. The oscillator receives a temperature variation with the predetermined period from the heating portion, and oscillates so as to generate ultrasonic waves.

Growing community of inventors

Obu, Japan

Yuta Hasebe