Dexerials Corporation

Yuta Araki

Tomoyuki Ishimatsu

Yasushi Akutsu

A connection structure: a first electronic component having a terminal pattern in which a plurality of terminals are arranged side by side in a radial form and a second electronic component having a terminal pattern corresponding to the terminal pattern of the first electronic component are anisotropically conductively connected using an anisotropic conductive film, (i) the effective connection area per terminal is 3000 &#x3bc;mor more, and the number density of conductive particles in the anisotropic conductive film is 2000 particles/mmor more and 20000 particles/mmor less, (ii) as the anisotropic conductive film, adopted is an anisotropic conductive film in which the conductive particles are arranged in a lattice form, and the arrangement pitch and the arrangement direction are configured such that each terminal captures three or more conductive particles, or (iii) as the anisotropic conductive film, adopted is an anisotropic conductive film having a multiple circular region.

Connection structure

An anisotropic conductive film that can be produced in high productivity and can reduce a short circuit occurrence ratio has a first conductive particle layer in which conductive particles are dispersed at a predetermined depth in a film thickness direction, and a second conductive particle layer in which conductive particles are dispersed at a depth different from that in the first conductive particle layer. In the respective conductive particle layers, the closest distances between the adjacent conductive particles are 2 times or more the average particle diameters of the conductive particles.

Anisotropic conductive film and production method of the same

An anisotropic conductive film contains conductive particles and spacers. The spacers are arranged at a central part of the film in a width direction. The central part of the film in the width direction represents 20 to 80% of the overall width of the film. The height of the spacers in the thickness direction of the anisotropic conductive film is larger than 5 &#x3bc;m and less than 75 &#x3bc;m. Such an anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, wherein the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.

To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm.

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Tochigi, Japan

Yuta Araki