Hitachi, Ltd.

Yusutsugu Yoshimura

Toshiyuki Kajiwara

Tadashi Nishino

Yoshio Takakura

Mitsuo Nihei

Takao Funamoto

Kenichi Yasuda

Fuminori Ishikawa

Hironori Shimogama

Takashi Mashiko

Gen Nagakubo

A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a moving mechanism is provided for relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing glade. A method for bonding is characterized by bonding metal plates by using the above apparatus.

Method of bonding metal plates, apparatus therefor and hot strip mill

A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.

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Hitachi, Japan

Yusutsugu Yoshimura