Matsushita Electric Industrial Co., Ltd.

Yusuke Yamamoto

Masafumi Inoue

Yasuhiro Morimitsu

Hikaru Onizaki

Youichi Yanai

Wataru Hidese

Yoichi Yanai

A method of mounting a component on electrodes on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solders for the component is situated on the electrodes. The printing positions of the solders are stored. Mounting position data for where the component is to be mounted on the solders is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Method component on a circuit board

A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Method of mounting component on a circuit board

A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

Component mounting method

An electronic components mounting device has a plurality of feeder bases attached with tape feeders thereon, and a guide rail and a cylinder for drawing each of the feeder bases independently to a position for replenishing electronic components. When an electronic component runs out of the storage, only the feeder base that is carrying the relevant tape feeder gone out of the stock is drawn to a place for parts replenishment; in the mean time, the mounting actions keep on going by making use of tape feeders attached on other feeder base. Machine stop times can be decreased with the mounting device.

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Fukuoka, Japan

Yusuke Yamamoto