Kabushiki Kaisha Toshiba

Chemetall Gmbh

Jfe Steel Corporation

Nippon Steel Corporation

Yahoo Japan Corporation

Nippon Paint Industrial Coatings Co., Ltd.

Yusuke Wada

Toshio Inbe

Takahiro Mori

Kenji Sasaoka

Hiroshi Odaira

Fumitoshi Ikegaya

Masanobu Futsuhara

Yasushi Arai

Eiji Imamura

Sadao Kowatari

Takeshi Yokota

Tatsuya Nakagaito

Yuki Toji

Hidekazu Minami

Masahiko Matsukawa

Lingling Yang

Michiya Higashi

Masataka Miyamura

Shotaro Terashima

Yoichiro Mori

Kotaro Kikuchi

Katsufumi Asai

Kazuhiro Takeda

Yuji Nakaizumi

Kensei Yuasa

Ikuo Akutagawa

Mitsutaka Nambo

Toshiharu Nakagawa

Michitoshi Saeki

A high strength steel sheet with a chemical composition containing C, Si, Mn, P, S, Al, N, Nb, Ti, and B, where [% Si]/[% Mn] is 0.10 or more and 0.60 or less, and free Ti content determined from Formula (1), below, is 0.001 mass % or more, with the balance being Fe and inevitable impurity. In a steel sheet surface layer, a total amount of Nb solute and 100 nm or smaller precipitate is 0.002 mass % or more.

High strength steel sheet, high strength coated or plated steel sheet, methods of producing same, and member

A steel sheet according to the present invention has a specific chemical composition and a steel microstructure including, in terms of area fraction, ferrite: 40% or more and 70% or less, a total of bainite and tempered martensite: 5% or more and 30% or less, retained austenite: 4% or more and 18% or less, fresh martensite: 8% or more and 35% or less, and the remainder: 5% or less. Cementite particles are present in the retained austenite, a ratio of an area fraction of the cementite particles in the retained austenite to an area fraction of the retained austenite is 5% or more and 25% or less, and the steel sheet has a tensile strength of 780 MPa or more and less than 980 MPa.

Steel sheet, member, and methods for manufacturing the same

Provided is a coated metal sheet for automobile comprising: a metal sheet; and a coating film (&#x3b1;) present on at least one surface of the metal sheet. The coating film (&#x3b1;) contains an organic resin (A), an electrically conductive pigments (B), and anti-corrosion pigments (C), and a Martens micro-hardness HM at &#x2212;20&#xb0; C. of the surface of the coating film (&#x3b1;) is 10 to 200 (mg/mm) at 20 points or more when measured at 100 points, and a Martens micro-hardness HM at 40&#xb0; C. of the surface of the coating film (&#x3b1;) is 200 to 200,000 (mg/mm) at 5 points or more when measured at 100 points.

Coated metal sheet for automobile excellent in rust resistance in low temperature running environments

A navigation device navigating a moving body based on position information includes a coordinated operation unit that initiates and ends a coordinated operation among a plurality of navigation devices; a guiding unit that performs navigation in at least one of the navigation devices performing the coordinated operation, while providing a screen display based on a designated position; and a second operating unit that performs a second operation in a navigation device other than a currently navigating navigation device performing the coordinated operation, the second operation including receiving an operation for a function that is not displayed on the screen of the currently navigating navigation device, and reflecting a position acquired as a result of the operation, to the other navigation devices performing the coordinated operation.

Navigation device, navigation method, and non-transitory computer readable storage medium

The present invention provides a surface conditioning composition having a surface conditioning function that is even more superior as compared with conventional surface conditioning compositions. A surface conditioning composition is provided for use in surface conditioning of a metal prior to being subjected to a phosphate-based chemical conversion treatment, in which the surface conditioning composition has a pH of 3 to 12, and includes nearly spherical zinc phosphate particles having an average particle diameter from 0.05 &#x3bc;m to 3 &#x3bc;m, and in which the zinc phosphate particles are produced by mixing at least one kind of zinc compound particles selected from the group consisting of zinc oxide, zinc hydroxide, and basic zinc carbonate with phosphoric acid and/or condensed phosphoric acid to allow for their reaction in an acidic aqueous solution having a pH lower than 7, and dispersing and stabilizing by a dispersion means.

Surface conditioning composition, method for producing the same, and surface conditioning method

An analog-to-digital converter includes a switched capacitor circuit, an analog-to-digital conversion circuit, and a constant current circuit. The switched capacitor circuit includes first and second input terminals for a differential input, and is configured to sample an analog voltage of the differential input. The analog-to-digital conversion circuit is connected to output terminals of the switched capacitor circuit, and configured to convert the sampled analog voltage into a digital signal and output the digital signal. The constant current circuit is connected to at least one of the first and second input terminals.

Analog-to-digital converter having a switched capacitor circuit

A surface conditioning composition for use in surface conditioning of a metal prior to being subjected to a phosphate-based chemical conversion treatment, in which the surface conditioning composition has a pH of 3 to 12, and includes at least one kind of zinc compound particles selected from the group consisting of zinc oxide particles, zinc hydroxide particles, and basic zinc carbonate particles; phosphoric acid and/or condensed phosphoric acid; and an amine compound having a specific structure and in which the zinc compound particles are dispersed and stabilized by the phosphoric acid and/or condensed phosphoric acid, and the amine compound.

A surface conditioning composition is provided in which a titanium phosphate compound can be stored in the state of a dispersion liquid for a long period of time while being stably present in the dispersion liquid, with favorable stability also in the bath, and with the composition being capable of forming a conversion coating film in a sufficient amount of the film even in the case of application to conversion resistant metal materials such as high-tensile steel sheets.

Surface conditioning composition and surface conditioning method

A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

Circuit devices and fabrication Method of the same

A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically Connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

Circuit devices and fabrication method of the same

A light-emitting diode device includes a light-emitting diode chip, lead-frames respectively connected to an anode and a cathode of the light-emitting diode chip, an encapsulant for encapsulating the light-emitting diode chip and the lead-frames, and a buffer layer, formed between the encapsulant, on the one hand, and the light-emitting diode chip and the lead-frames, on the other, for reducing the stress acting from the encapsulant onto the light-emitting diode chip and the lead-frames. This device can be minimized degradation of quality caused by this stress, and maintained high product quality for a long period of time. An encapsulating epoxy resin composition contains 100 parts by weight of an epoxy resin, 70 to 140 parts by weight of a curing agent including an acid anhydride, 0.5 to 4.0 parts by weight of a curing accelerator including an onium or diazabicycloalkene salt, and 0.1 to 5.0 parts by weight of a thiophosphite. This resin composition can be suitably used as an encapsulant for LED devices.

Acid anhydride-cured epoxy resin encapsulant with triorganothiophosphite

A solder resist composition contains a specified partially acrylated and/or methacrylated bisphenol A novolak epoxy resin component, and a specified partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin component. The composition further contain a photopolymerization initiator, a thermosetting agent, an inorganic filler, and an organic solvent. The composition may further include a silane or titanate coupling agent.

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Tokyo, Japan

Yusuke Wada