Denso Corporation

Yusuke Tainaka

Akira Shintai

Kazuhiro Aoki

Shinji Kawano

Yuuji Kakuya

Kenji Goto

Shuji Hirata

Masahiro Matsunoshita

Atsushi Munaoka

A double-sided board includes a first-type conductor layer, a second-type conductor layer, a waveguide-filled dielectric layer and a waveguide. The waveguide-filled dielectric layer is a dielectric layer provided between the first-type conductor layer and the second-type conductor layer. The waveguide is provided in such a manner as to penetrate the waveguide-filled dielectric layer in a direction from one of the first-type conductor layer and the second-type conductor layer to the other of the two conductor layers. A cross section of the waveguide in a plane parallel to the first-type conductor layer has a longitudinal direction and a lateral direction perpendicular to the longitudinal direction. The cross section of the waveguide has, along the longitudinal direction, a central part and two end parts located respectively on two sides of the central part. A lateral length of each of the end parts is larger than a lateral length of the central part.

Double-sided board, radar apparatus, transmission member, and method of manufacturing transmission member

A radar apparatus includes a board, a high-frequency integrated circuit mounted to the board, a metallic housing arranged to face the high-frequency integrated circuit, and a radio-absorbing and heat-dissipating unit. The radio-absorbing and heat-dissipating unit includes a radio-absorbing and heat-dissipative gel. The radio-absorbing and heat-dissipating unit is configured to cover at least part of the high-frequency integrated circuit and to be in contact with the metallic case.

Radar apparatus

In a radar apparatus, a high-frequency integrated circuit is mounted to a board, and a shielding case encloses the high-frequency integrated circuit. A radio-absorbing and heat-dissipative gel is arranged to cover at least part of the high-frequency integrated circuit and to be in contact with the shielding case.

A radar device includes: a substrate including multiple high-frequency conductor layers arranged on a front surface; a semiconductor component in contact with the high-frequency conductor layers via conductive members; and an adhesive that bonds the semiconductor component to the front surface of the substrate. The semiconductor component has a bottom surface and a first side surface facing in a first direction. All the multiple high-frequency conductor layers include at least high-frequency conductor layers bending in a plane of the front surface and thereby extend, on the front surface, from inside ends facing the bottom surface to outside ends positioned in the first direction from the first side surface. The adhesive is in contact with the front surface except for the sites of the multiple high-frequency conductor layers formed and in contact with the side surfaces of the semiconductor component.

Radar device

A transmission line assembly is configured such that (i) a first target inner layer is one of second to (N−1)-th pattern layers selected therefrom, and (ii) a second target inner layer is another one of the second to (N−1)-th pattern layers selected therefrom; the second to (N−1)-th pattern layers except for the first and second target inner layers are referred to as inner layers. The transmission line assembly includes band-like first and second slits formed through the ground pattern of a corresponding one of the first and second target inner layers to expose a part of one of dielectric layers; the one of the dielectric layers is adjacent to the corresponding one of the first and second target inner layers. Each of the first and second slits has an edge facing the interlayer line, and the edge of each of the first and second slits is concavely curved toward the interlayer line.

Growing community of inventors

Kariya, Japan

Yusuke Tainaka