Tanaka Kikinzoku Kogyo K.k.

Yusuke Ohshima

Junichi Taniuchi

Hitoshi Kubo

Yuichi Makita

Noriaki Nakamura

Dai Shinozaki

Hidekazu Matsuda

Kenji Matsuda

Hiroshi Noguchi

Provided are a fine silver particle ink composed of hexylamine, dodecylamine, oleic acid, fine silver particles and a solvent, in which the volume resistivity of a sintered body at 100&#xb0; C. obtained after the ink is applied on a substrate by spin coating is 8 to 25 &#x3bc;&#x3a9;cm, a sintered body thereof, and a method for producing a fine silver particle ink. When a fine silver particle ink containing coated fine silver particles is produced by a silver-amine complex decomposition method, production can be carried out smoothly. The fine silver particle ink can be sintered even at a low temperature, and a sintered body thereof has a mirror surface and low volume resistance.

Fine silver particle ink, fine silver particle sintered body, and method for producing fine silver particle ink

A semiconductor device includes a semiconductor chip which can be a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is built in. A sintered-silver-coated film is adhered on a surface layer part of the semiconductor substrate, interposed by a silicon oxide film. A heat-dissipating fin (heat sink), which may be copper or aluminum, is bonded on the sintered-silver-coated film, interposed by an adhesive layer.

Semiconductor device and heat-dissipating mechanism

Growing community of inventors

Tsukuba, Japan

Yusuke Ohshima