Adeka Corporation

Yusuke Nuida

Hiroshi Morita

Hitoshi Hosokawa

The present invention provides a resin composition that contains copper particles and a particular resin and that is capable of producing a cured product having a low volume resistance value, and a cured product obtained by curing the resin composition. The resin composition contains (A) copper particles having an average particle diameter of 0.1 to 20 μm, (B) a phosphoric acid-modified epoxy resin obtained by reacting a phosphoric acid (b1) with an epoxy compound (b2), and (C) a curing agent, wherein the content of the component (B) and the content of the component (C), based on 100 parts by mass of the total amount of the components (A) to (C), are 0.1 to 30 parts by mass and 0.1 to 5 parts by mass, respectively. Further, the cured product is obtained by curing the resin composition.

Resin composition, method for forming cured product, and cured product

A method of manufacturing copper powder according to the present invention includes: a first step of reducing copper particles in water by using at least one compound selected from the group consisting of potassium borohydride, sodiumborohydride, and lithium borohydride; after the first step, a second step of washing with water; a third step of washing copper powder obtained in the second step with at least one compound selected from the group consisting of ether compounds and alcohol compounds; and a fourth step of bringing the copper powder obtained in the third step into contact with an organic acid solution, in which at least one compound selected from the group consisting of ether compounds and alcohol compounds is used as a solvent.

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Tokyo, Japan

Yusuke Nuida