Nippon Pillar Packing Co., Ltd.

Yusuke Natsuhara

Akira Nakatsu

Takeshi Okunaga

Kojiro Iwasa

A method for producing a high frequency circuit board includes forming an antenna pattern on an upper surface of the provisional substrate. The method includes performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked on the upper surface of the provisional substrate, to form a first dielectric layer portion covering the antenna pattern. The method includes removing the provisional conductor and shaving the first dielectric layer portion to form a cavity to house an electronic component. The method includes mounting the electronic component on the antenna pattern in the cavity. The method includes performing hot-press in a state where a thermosetting resin and a ground conductor are stacked at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion to embed the electronic component in the cavity. The method includes removing the provisional substrate.

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Osaka, Japan

Yusuke Natsuhara