Mitsubishi Electric Corporation

Yusuke Morimoto

Shunsuke Sasaki

Kohei Sato

Toshiki Asai

Yoshiko Fujima

Yasuyuki Miyazaki

Shusaku Nakase

A phase difference correction control unit determines, based on a difference between a voltage of a first input smoothing capacitor and a voltage of a second input smoothing capacitor, a difference between a current flowing through a first switching element and a current flowing through a second switching element, or a difference between a reactor current when a gate signal of the first switching element is turned on and a reactor current when a gate signal of the second switching element is turned on, an amount of correction of a difference between a phase of switching of the first switching element and a phase of switching of the second switching element. A switching control unit switches the first switching element and the second switching element based on the amount of correction.

Double step-down chopper circuit

There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate () having a mounting hole () that penetrates through the first insulating substrate () from a first surface () to a second surface (); a second insulating substrate () including a connection portion () that penetrates through the mounting hole () from the first surface () side and protrudes from the second surface (); first electrodes (and) that are provided on the second surface () and are arranged at an edge of the mounting hole (); and second electrodes (and) provided on the connection portion (). The first electrodes (and) and the second electrodes (and) are joined by solder. The printed circuit board further includes a coating film () that is disposed at least on a front end side of the connection portion () than a portion where the second electrodes (and) are joined to the first electrodes (and) by the solder.

Printed circuit board

A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.

A printed circuit board assembly includes a first printed circuit board with first surface and second surface with a slit portion and a second printed circuit board with third surface and fourth surface with a first end portion and a second end portion. The first end portion is fitted in the slit portion and a tip of the first end portion protrudes from the second surface. The first printed circuit board includes first electrodes arranged along the slit portion in a longitudinal direction of the slit portion on the second surface. The second printed circuit board includes second electrodes arranged in the first end portion on the third and fourth surfaces. The second electrodes are joined to the first electrodes with solder. The first printed circuit board includes a support fixed to the first surface. The second printed circuit board is attached to the support by an adhesive substance.

Printed circuit board assembly

A printed wiring board includes a main substrate, a standing substrate, a first electrode portion, and a second electrode portion. The second electrode portion is connected to the first electrode portion with solder while a support portion is inserted in a slit. The first electrode portion is provided to reach the slit. The second electrode portion is disposed to span from a bottom surface to a height position higher than or equal to a midpoint between a top surface and the bottom surface.

Printed wiring board and method for manufacturing the same

A first substrate has a slit formed therein, passing through the first substrate from one first primary surface to the other first primary surface opposite the one first primary surface, the first substrate including at least one first electrode. A second substrate has one second primary surface and the other second primary surface opposite the one second primary surface, the second substrate: including a support inserted in the slit so as to intersect with the first substrate; and having at least one second electrode on the support. The first electrode and the second electrode are bonded by a solder. A dimension of the slit in the longitudinal direction is greater than the sum of a design dimension of the support in the longitudinal direction, a maximum design dimension tolerance of the support in the longitudinal direction, and a maximum design dimension tolerance of the slit in the longitudinal direction.

Printed wiring board

A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.

Growing community of inventors

Tokyo, Japan

Yusuke Morimoto