Kobe Steel, Ltd.

Yusuke Momota

Shogo Murakami

Soichiro Kojima

Yukihide Honda

Takashi Choda

Shigeomi Araki

A forging die device is provided with an upper dieand a lower die. At least one die() of the upper dieand the lower diehas a die holder() which surrounds the outer periphery of the die() and holds the die(). The die holder() is configured to bear the radial tensile stress (tensile force) received by the die() during forging. By this means, the die() can be miniaturized.

Forging die device

A forging die device is configured in such a manner that die heating heater platesare disposed respectively between a diewhich is held at the outer periphery by die holders, and die holding meanscomposed of heat insulating platesand die plates, and the die holders, the die holding means and the die plates are integrated together. After the preheated dieis placed on the heated die holding means, the dieis heated by heating means, and forming surfacesof the die are heated to a required temperature immediately before forging.

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Takasago, Japan

Yusuke Momota