Seiko Epson Corporation

Yusuke Matsuzawa

Tomoyuki Kamakura

Takuya Kinugawa

Yuji Chino

A resonator device includes a base and a resonator component disposed on the base. The base includes a semiconductor substrate having a first surface and a second surface that are in a front-to-back relation with each other; an integrated circuit that includes a wiring layer disposed at the second surface side and including a connection pad and includes an insulating layer disposed between the second surface and the wiring layer; a through electrode that penetrates the semiconductor substrate and the insulating layer and is coupled to the connection pad; and an annular metal layer that is disposed so as to penetrate the insulating layer between the second surface and the wiring layer and surrounds the through electrode in a plan view of the semiconductor substrate.

Resonator device and method for manufacturing resonator device

A vibrator device includes a vibrator element, a container in which the vibrator element is housed, a circuit which is disposed in the container, and which overlaps the vibrator element in a plan view, and an inductor which is disposed in the container, which fails to overlap the vibrator element in the plan view, and which is electrically coupled to the circuit. The container includes at least a first member and a second member, and a bonding area configured to bond the first member and the second member to each other, and the inductor is disposed in the bonding area.

Vibrator device

A vibrator device includes a semiconductor substrate, a vibrator unit, a cover, and an insulating film. The vibrator unit is disposed at a first surface of the semiconductor substrate, and includes a vibrator element, and an excitation electrode disposed at the vibrator element and having a portion facing the semiconductor substrate. The cover is bonded to the first surface in a joint portion surrounding the vibrator unit. The insulating film is disposed at the first surface. The insulating film overlaps the portion of the excitation electrode in plan view, and is absent at the joint portion of the semiconductor substrate and the cover.

Vibrator device, and electronic device

A vibration device includes: a first substrate including a first surface and a second surface located at an opposite side of the first surface, and a first integrated circuit disposed on at least one of the first surface and the second surface; a second substrate including a third surface bonded to the second surface, a fourth surface located at an opposite side of the third surface, a recess that opens to the third surface, and a second integrated circuit disposed on the fourth surface; and a vibration element accommodated in a space defined by an opening of the recess being closed by the first substrate.

Vibration device, electronic apparatus, and vehicle

A vibrator device includes a silicon substrate having a through hole, a first terminal placed on a first surface of the silicon substrate, a second terminal placed on a second surface opposite to the first surface of the silicon substrate, a wire passing the through hole and electrically coupling the first terminal and the second terminal, a resin layer placed between the wire and an inner wall defining the through hole, a silicon oxide layer placed between the resin layer and the inner wall, and a vibrator element bonded to the first terminal.

Vibrator device and electronic apparatus

A pressure sensor has a substrate having a diaphragm, a cavity portion that is positioned on one side of the diaphragm, and a ceiling portion that is disposed opposite to the diaphragm via the cavity portion, and unevenness is formed on a surface of the substrate facing the cavity portion. In addition, the unevenness has a plurality of recessed portions.

Pressure sensor, manufacturing method of pressure sensor, altimeter, electronic apparatus, and moving object

A physical quantity sensor includes a substrate, a piezoresistive element that is arranged on one face side of the substrate, a wall portion that is arranged to surround the piezoresistive element on the one face side of the substrate in a plan view of the substrate, and a ceiling portion that constitutes a cavity portion with the wall portion, in which the ceiling portion includes a cladding layer that has a pore which passes therethrough in the thickness direction of the cladding layer, and a seal layer that is stacked on the opposite side of the cladding layer from the substrate and closes the pore, the seal layer in which at least a part of the outer periphery of a contact portion where the seal layer is in contact with the cladding layer is on the outside of the cavity portion in a plan view.

Electronic device, physical quantity sensor, pressure sensor, vibrator, altimeter, electronic apparatus, and moving object

A physical quantity sensor includes a semiconductor substrate, a diaphragm section that is disposed on the semiconductor substrate and is flexurally deformed when receiving pressure, a sensor element that is disposed on the diaphragm section, an element-periphery structure member that is disposed on one surface side of the semiconductor substrate and forms a cavity section together with the diaphragm section, and a semiconductor circuit that is provided on the same surface side as the element-periphery structure member of the semiconductor substrate.

Physical quantity sensor, pressure sensor, altimeter, electronic apparatus, and moving object

A MEMS device is a MEMS device having a MEMS vibrator which includes a plurality of MEMS constituent elements laminated and formed above a first foundation portion which is laminated above a main surface of a wafer substrate, and the MEMS constituent elements are laminated above a first oxide film and a nitride film so as to cover an opening which is formed in the nitride film and exposes a second foundation portion above which the nitride film is laminated.

MEMS device, electronic apparatus, and manufacturing method of MEMS device

A MEMS element includes a substrate which includes a flexible portion, a fixation electrode which is provided on a principal surface of the substrate, and a movable electrode which includes a movable portion which is separated from the fixation electrode, overlaps with at least a portion of the fixation electrode in a plan view of the principal surface, and is driven in a direction intersecting the principal surface, and a fixation end connected to the principal surface. The fixation electrode and the movable electrode is disposed to correspond to the flexible portion.

Growing community of inventors

Chino, Japan

Yusuke Matsuzawa