Threebond Co., Ltd.

Mitsubishi Electric Corporation

Yusuke Kuwahara

Makoto Kato

Hitoshi Mafune

Soichi Ota

Masayuki Osada

Kazuhiko Kawai

Tomoya Kodama

Ippei Shinoda

The photocurable resin composition of the present invention has a reaction force at 10% compression of a cured product of the photocurable resin composition of 1 to 300 kPa and a reaction force at 50% compression of the cured product of the photocurable resin composition of 1 to 500 kPa, contains a hollow organic resin filler as a component (A), and does not contain a monofunctional acrylic monomer having a hydroxyl group.

Photocurable resin composition, cured product, and laminated body

An object of the present invention is to provide a photocurable resin composition capable of obtaining a cured product having excellent quick curability by irradiation with a low integrated light intensity and flexibility. A photocurable resin composition containing the following components (A) to (E):

Photocurable resin composition, cured product, and laminate

In the (meth)acrylic resin composition of the present invention, when a sealed container is used, it is possible to achieve both storage stability in an atmosphere at 25&#xb0; C. and low temperature curability in an atmosphere at 60 to 140&#xb0; C., and further, properties thereof can be exhibited even in an electroconductive adhesive including electroconductive particles. The present invention is a (meth)acrylic resin composition including the following components (A) to (C): component (A): a urethane modified oligomer having a (meth)acrylic group, component (B): a monomer having a hydroxyl group and/or a carboxylic group and one (meth)acrylic group in a molecule in which a surface tension is 25 to 45 mN/m, and component (C): an organic peroxide having a specific structure.

(Meth) acrylic resin composition and electroconductive adhesive using the same

An adhesive composition which is excellent in adhesion to various hardly adhesive materials such as polyethylene terephthalate, polyethylene, polypropylene, modified polyphenylene ether, polyphenylene sulfide, and a cycloolefin polymer. Further, an adhesive composition containing the following components (A) to (C) may be described Component (A): (Meth) acrylic triblock elastomer having a weight average molecular weight of 80,000 or more, Component (B): (Meth) acrylate monomer having no hydroxyl group and having a phenoxy group, and Component (C): Radical initiator.

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Tokyo, Japan

Yusuke Kuwahara