Dexerials Corporation

Sony Corporation

Yusuke Kubo

Keisuke Aramaki

Tatsuo Kumura

Sergey Bolotov

Kazuhiko Suzuki

Yoshihiro Kato

Hiroyuki Ryoson

Keisuke Mukasa

Yuma Sato

A method for producing a heat transfer sheet, includes: (A) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B) slicing the molded body into a sheet shape to obtain a molded sheet; (C) pressing the molded sheet; and (D), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.

Heat transfer sheet, method for producing heat transfer sheet, heat transfer sheet package, and method for producing heat transfer sheet package

Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor deviceincludes a semiconductor element; a conductive cooling memberprovided above the semiconductor element, a conductive thermally conductive memberthat is provided between the semiconductor elementand the cooling memberand contains a cured resin. The conductive thermally conductive memberis connected to a groundin the substrateto electrically connect the cooling memberand the ground

Semiconductor device and method of producing the same

A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.

Thermally conductive sheet and method for manufacturing thermally conductive sheet

A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5&#xb0; C.&#xb7;cm/W or less.

Method for producing thermally conductive sheet

Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor deviceincludes a semiconductor device; a tubular conductive shield canprovided to surround a side surfaceof the semiconductor device; a conductive cooling member; and a conductive thermally conductive sheetformed between the semiconductor deviceand the cooling member. The conductive shield canand the cooling memberare electrically connected through the conductive thermally conductive sheettherebetween.

Provided is an electronic device capable of simultaneously achieving heat dissipation, electromagnetic wave suppression effect and ESD protection at a high level. The device includes: an electronic componentprovided on a substrate; an electrically conductive shielding canhaving an openingand provided so as to surround the electronic componentand connected to a ground; an electrically conductive cooling memberprovided on the top of the electrically conductive shielding can; a thermally and electrically conductive sheetprovided between the electronic componentand the electrically conductive cooling member; and an insulating memberprovided between the thermally and electrically conductive sheetand the electrically conductive cooling memberand facing the electronic componentthrough the opening, wherein the insulating memberhas a size equal to or larger than the region of the electronic componentfacing through the opening, and the electrically conductive shielding canand the electrically conductive cooling memberare electrically connected through the thermally and electrically conductive sheet

Electronic device

Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.

Electromagnetic wave absorbing heat conductive sheet, method for producing electromagnetic wave absorbing heat conductive sheet, and semiconductor device

A coil module is provided which has been reduced in size and thickness by incorporating a material and a structure resistant to magnetic saturation. The coil module includes a magnetic shielding layer containing a magnetic material, and a spiral coil. The magnetic shielding layer has a plurality of magnetic resin layers containing magnetic particles, and at least a portion of the spiral coil is buried in a portion of the magnetic resin layers. This allows a reduction in size and thickness while achieving a heat dissipation effect by the magnetic resin layers. In addition, since magnetic resin layers resistant to magnetic saturation are provided, the coil inductance changes only slightly even in an environment where a strong magnetic field is applied, and thus stable communication can be provided.

Coil module

A composition for electromagnetic wave suppression and heat radiation includes: a matrix composed of a high molecular material or a low molecular material; and a magnetic particle filled in the matrix upon mixing a magnetic powder having a relation of {(tap density)/density}&#x2267;0.58 with the matrix.

Composition for electromagnetic wave suppression and heat radiation and method for manufacturing composition for electromagnetic wave suppression and heat radiation

Growing community of inventors

Tochigi, Japan

Yusuke Kubo