Seiko Epson Corporation

Ngk Insulators, Inc.

Seiko Epson Corportion

Yusuke Kinoshita

Nobuyuki Imai

Masayasu Sakuma

Yoshikuni Saito

Takayuki Kikuchi

Yoshihiro Kobayashi

Shigeki Hayashi

Osamu Kawauchi

Yoshio Maeda

Katsumi Takayama

Manabu Takeuchi

Keita Ito

Shouichi Komatsu

An inertia measurement device, which is used in combination with a satellite positioning receiver that outputs a positioning result at every T seconds in a positioning system equipped on a vehicle, when a Z-axis angular velocity sensor, a position error P[m] based on the detection signal of the Z-axis angular velocity sensor while the vehicle moves at a moving speed V[m/sec] for T seconds satisfies Pp≥P=(V/Bz)×(1−cos(Bz×T)) (where, a bias error of the Z-axis angular velocity sensor is Bz[deg/sec] and a predetermined allowable maximum position error during movement for T seconds is Pp[m]), and a bias error Bx and By of the Y-axis angular velocity sensor satisfies Bz<Bx and Bz<By.

Inertia measurement device, vehicle, and electronic device

An inertia measurement device, which is used in combination with a satellite positioning receiver that outputs a positioning result at every T seconds in a positioning system equipped on a vehicle, when a Z-axis angular velocity sensor, a position error P[m] based on the detection signal of the Z-axis angular velocity sensor while the vehicle moves at a moving speed V[m/sec] for T seconds satisfies Pp&#x2265;P=(V/Bz)&#xd7;(1&#x2212;cos(Bz&#xd7;T)) (where, a bias error of the Z-axis angular velocity sensor is Bz[deg/sec] and a predetermined allowable maximum position error during movement for T seconds is Pp[m]), and a bias error Bx and By of the Y-axis angular velocity sensor satisfies Bz&#x3c;Bx and Bz&#x3c;By.

A sensor unit with high reliability and stable detection accuracy against vibrations of an installation target object is to be provided. A sensor unit includes: a sensor module configured including a substrate with inertial sensors mounted thereon, and an inner case in which the substrate is installed; and an outer case accommodating the sensor module. A recessed part is formed in the inner case. The inertial sensors are arranged in an area overlapping with the recessed part as viewed in a plan view seen from the direction of thickness of the substrate, and a filling member is provided to fill a space formed by the substrate and the recessed part. The sensor module is joined to a bottom wall of the outer case via a joining member.

Sensor unit, electronic apparatus, and moving body

An inertia measurement device, which is used in combination with a satellite positioning receiver that outputs a positioning result at every T seconds in a positioning system equipped on a vehicle, when a Z-axis angular velocity sensor, a position error P[m] based on the detection signal of the Z-axis angular velocity sensor while the vehicle moves at a moving speed V [m/sec] for T seconds satisfies Pp&#x2265;P=(V/Bz)&#xd7;(1&#x2212;cos (Bz&#xd7;T)) (where, a bias error of the Z-axis angular velocity sensor is Bz [deg/sec] and a predetermined allowable maximum position error during movement for T seconds is Pp[m]), and a bias error Bx and By of the Y-axis angular velocity sensor satisfies Bz&#x3c;Bx and Bz&#x3c;By.

A sensor unit includes: a sensor device including an inertial sensor; a substrate to which the sensor device is bonded; a case member accommodating at least the sensor device; and an adhesive member provided to cover, in a plan view of the substrate as viewed from the case member side, an outer periphery of the sensor device and so as to connect the sensor device with the case member.

Sensor unit having an adhesive member connected to an outer edge of a sensor device and placed continuously in an area overlapping a sensor device

A sensor unit includes sensors. Each of the sensors provides a measurement axis. A connector is electrically connected with the sensors. The position of the connector is fixed relative to the sensors. A memory unit stores calibration information which specifies the respective directions of the measurement axes with respect to a reference plane established for the connector.

Sensor unit, electronic device, and moving body

A sensor unit is provided with a sensor device. The sensor device has a first electrode disposed on an outer surface. A board is provided with a first surface and a second surface in an obverse-reverse relationship with each other, and a side surface. A first conductive terminal is disposed along a contour of the first surface. The sensor device has the outer surface disposed along the side surface of the board, and has the first electrode connected to the first conductive terminal with a first conductive body, and a first projection length of the outer surface projecting on the first surface side is smaller than a second projection length of the outer surface projecting on the second surface side.

Sensor unit, method of manufacturing the same, electronic apparatus, and moving object

A method of manufacturing a piezoelectric device having a resonator element, a package having a base, a lead wire having opposite ends with one end connected to the base and to a support substrate for supporting such end of the lead wire on the package with the support substrate having at least one open window section on an undersurface side thereof which is in an obverse and reverse relationship to the surface of the substrate facing the resonator element wherein the other end of the lead wire is joined to the substrate through the open window section on said undersurface side of the support substrate.

Method of manufacturing a piezoelectric device

A structure for supporting a vibratoris provided. The structure comprises a substrateand bonding wiresA,B fixed to the substrateand connected with the vibrator. The vibratoris supported with the bonding wires so that the vibratoris not directly contacted with the substrate. 'fd' and 'fw' satisfy the following formula (1). &#x201c;fd&#x201d; represents a resonance frequency of a driving vibration mode of the vibrator and &#x201c;fw&#x201d; represents a characteristic frequency of a vibration mode of the bonding wire at room temperature.(/2)&#xd7;1.05&#x2266;, or,&#x2266;(/2)&#xd7;0.95.&#x2003;&#x2003;(1)

Structures for supporting vibrators and devices for measuring physical quantities

It is provided a supporting structure having a substrateand bonding wiresA,B fixed onto the substrateand connected to a vibratorThe substratehas a pair of fixed portionsopposing each other and a pair of non-fixed portionsopposing each other. The fixed portionsand the non-fixed portionstogether define a through holeA in the substrateThe vibratoris supported with the bonding wire so that the vibratoris not directly contacted with the substrateThe bonding wiresA,B are fitted to the fixed portionand is not fitted to any of the non-fixed portions

A piezoelectric device including an IC chip mounted on an inner bottom surface of a package, and a piezoelectric vibrating reed electrically and mechanically connected onto a TAB tape in which a lead is provided on a surface of a resin tape. The TAB tape to which the piezoelectric vibrating reed has been joined is mounted in the package, whereby the piezoelectric vibrating reed is arranged above the IC chip.

Piezoelectric device

A piezoelectric device and method comprising a piezoelectric vibrating reedand excitation electrodes which are mounted in a package having a package baseand outer terminals using a TAB tapecomposed of a plurality of electrical conductors formed on an insulating material with each of the plurality of electrical conductors disposed in an arrangement forming predetermined winding patternsthereon with the wiring patternsinterconnecting the excitation electrodes to the outer terminals.

Growing community of inventors

Minowa, Japan

Yusuke Kinoshita