Sanyo Electric Co., Ltd.

Kanto Sanyo Semiconductors Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Sanyo Semiconductor Co., Ltd.

Kanto Sanyo Semiconductor Co., Ltd.

Yusuke Igarashi

Noriaki Sakamoto

Yoshiyuki Kobayashi

Kouji Takahashi

Eiju Maehara

Junji Sakamoto

Yukio Okada

Hideki Mizuhara

Takeshi Nakamura

Ryosuke Usui

Sadamichi Takakusaki

Nobuhisa Takakusaki

Jun Sakano

Yasunori Inoue

Motoichi Nezu

Yasuhiro Kohara

Takaya Kusabe

Mayumi Nakasato

Katsumi Okawa

Noriaki Kojima

Masayuki Nagamatsu

Noriyasu Sakai

Ryoichi Takahashi

Ryosuke Usul

Masato Noguchi

Hayato Abe

Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.

Element mounting substrate and semiconductor module

A circuit device of the present invention includes a wiring board, and circuit elements such as semiconductor elementsmounted on the wiring board. The wiring boardincludes: a conductive pattern, which is a metal core layer; a first insulating layerand a second insulating layerrespectively covering an upper surface and a lower surface of the conductive pattern; and a first wiring layerand a second wiring layerformed respectively on an upper surface of the first insulating layerand a lower surface of the second insulating layer. The conductive patternis made of rolled metal. With this configuration, the thermal resistance of the conductive pattern, which is the metal core, is reduced, and the thermal dissipation of the entire device can be improved.

Metal core circuit element mounting board

A technology is provided for a packaging board adapted to mount a device capable of improving handleability and securing connection reliability. The packaging board includes: a pad electrode formed on a substrate; an insulating layer covering the substrate, having an opening at least in part in an area over the pad electrode; and a joint layer formed on the pad electrode inside the opening. The surface of the joint layer is lower than the top lip of the opening.

Packaging board, semiconductor module, and portable apparatus

In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.

Circuit device and method of manufacturing the same

A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.

Method for manufacturing circuit device

A circuit device including a multilayer wiring structure having an improved heat radiation performance, and a manufacturing method thereof is provided. A circuit device of the invention includes a first wiring layer and a second wiring layer laminated while interposing a first insulating layer. The first wiring layer is connected to the second wiring layer in a desired position through a connecting portion formed so as to penetrate the first insulating layer. The connecting portion includes a first connecting portion protruding in a thickness direction from the first wiring layer, and a second connecting portion protruding in the thickness direction from the second wiring layer. The first connecting portion and the second connecting portion contact each other at an intermediate portion in the thickness direction of the insulating layer.

Circuit device and manufacturing method thereof

Provided are a hybrid integrated circuit device in which fine patterns can be formed while current-carrying capacitances are ensured, and a method of manufacturing the same. The hybrid integrated circuit device of the present invention includes conductive patterns formed on a front surface of a circuit substrate and circuit elements electrically connected respectively to the conductive patterns. The conductive patterns include a first conductive pattern and a second conductive pattern formed more thickly than the first conductive pattern. The second conductive pattern includes a protruding portion protruding in a thickness direction thereof.

A circuit device manufacturing method is provided, wherein the adhesion of an overcoat resin, formed on a conductive wiring layer, to a sealing resin layer is improved by irradiating plasma onto the overcoat resin. A first conductive filmA and a second conductive filmB, which are laminated with an interlayer insulating layerinterposed in between, are formed. By selectively removing the first conductive film, a first conductive wiring layerA is formed and the first conductive wiring layer is covered with an overcoat resin. Overcoat resinis irradiated with plasma to roughen its top surface. A sealing resin layeris formed so as to cover the top surface of the roughened overcoat resinand circuit elements

Circuit device manufacturing method

A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin film covering the isolation trench thicker than the resin film covering upper surfaces of the conductive patterns, exposing the upper surfaces of the conductive patterns out of the resin film by removing the resin film, electrically connecting the conductive pattern exposed out of the resin film to a circuit element, forming sealing resin to seal the circuit element, and removing a rear surface of the conductive foil until the conductive patterns are mutually isolated.

A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing method thereof, a first conductive film is laminated on a first insulating layer, and a first wiring layer is formed by patterning the first conductive film. Next, a second conductive film is laminated on a second insulating layer. Thereafter, by partially removing the second insulating layer and the second conductive film in a desired spot, a connection part for connecting the wiring layers to each other is formed.

The present invention provides a low-profile and light-weight semiconductor device having improved product reliability and higher frequency performance. A multi-layer interconnect line structure is disposed just under circuit devicesandAn Interlayer insulating filmthat composes a part of the multi-layer interconnect line structure is formed of a material having a relative dielectric constant within a range from 1.0 to 3.7, and a dielectric loss tangent within a range from 0.0001 to 0.02.

Semiconductor device, method for manufacturing same and thin plate interconnect line member

A circuit device having a multilayered wiring structure and an excellent heat dissipation property, and a method of manufacturing the circuit device are provided. In a circuit device, a multilayered wiring structure including a first conductive pattern and a second conductive pattern is formed on a surface of a circuit substrate. A first insulating layer is formed entirely on the surface of the circuit substrate. The first conductive pattern and the second conductive pattern are mutually insulated by a second insulating layer. An amount and grain sizes of filler included in the second insulating layer are smaller than an amount and grain sizes of filler included in the first insulating layer. Therefore, it is easier to connect the above two conductive patterns by way of penetrating the second insulating layer.

A circuit device which enables formation of a minute pattern while securing a current capacity and has excellent heat release properties, and a manufacturing method thereof are provided. In a circuit device of the present invention, among multiple wiring layers, a first wiring layer is formed of a thin first conductive pattern and a thick second conductive pattern. Therefore, formation of the minute patterns is realized while securing the current capacity. Moreover, a small-signal circuit element is mounted on the first conductive pattern, and a large-current circuit element is mounted on the second conductive pattern. Thus, circuit elements having different sizes of currents to be handled are mounted on the same board. Furthermore, heat release properties are improved by the second conductive pattern which is formed to be thick.

In order to prevent, in a resin sealing step, a conductive foilfrom locally rising because of concentration of air intervening between the conductive foiland lower moldA due to the charged pressure, a method for manufacturing circuit devices is provided. The method for manufacturing circuit devices includes the step of forming conductive patterns, which form a plurality of mounting portionsof a circuit elementon a conductive foil, in each block, the step of disposing the circuit elementon each mounting portionof the conductive patternin each block, the step of performing resin sealing by bringing the lower moldA having an air ventinto contact with the backface of the conductive foilin each blockand by performing transfer molding with an insulating resinwhile disposing each mounting portionof the blockin the same cavity, and the step of separating each mounting portionby dicing.

Growing community of inventors

Gunma, Japan

Yusuke Igarashi