Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Yusuke Higashi

Takao Marukame

Yuichiro Mitani

Tsunehiro Ino

Yuuichi Kamimuta

Jiezhi Chen

Yoshifumi Nishi

Kazuya Matsuzawa

Masamichi Suzuki

Takahiro Kurita

Toshinori Numata

Yuki Sasaki

Tomoya Sanuki

Kensuke Ota

Yuuichiro Mitani

Haruki Toda

Hideaki Aochi

Masumi Saitoh

Hiroki Noguchi

Atsuhiro Kinoshita

Kenichi Murooka

Kiwamu Sakuma

Masaki Kondo

Satoru Takase

Chika Tanaka

Koichiro Zaitsu

Hiroki Tokuhira

Hirotaka Nishino

Mitsuhiro Tomita

Shuichi Toriyama

Harumi Seki

Reika Tanaka

Hideto Horii

Riichiro Takaishi

Izumi Hirano

Haiyang Peng

A semiconductor memory device according to an embodiment includes a stacked body in which a gate electrode layer and a first insulating layer are alternately stacked in a first direction, a semiconductor layer in the stacked body and extending in the first direction, a second insulating layer between the semiconductor layer and the stacked body, a third insulating layer provided between the second insulating layer and the stacked body, and a first layer between the second insulating layer and the third insulating layer. The first layer contains silicon and nitrogen and includes a first region between the gate electrode layer and the semiconductor layer and a second region between the first insulating layer and the semiconductor layer, the first region contains or does not contain fluorine, the second region contains fluorine, and a fluorine concentration of the second region is higher than a fluorine concentration of the first region.

Semiconductor memory device

A semiconductor memory device of an embodiment includes a semiconductor layer; a gate electrode including a first portion, a second portion provided to be spaced apart from the first portion, and a spacer provided between the first portion and the second portion; and a first insulating layer provided between the semiconductor layer and the gate electrode and including a first region containing a ferroelectric, a ferrielectric, or an anti-ferroelectric, a second region containing a ferroelectric, a ferrielectric, or an anti-ferroelectric, and a boundary region provided between the first region and the second region. The first region is positioned between the first portion and the semiconductor layer, the second region is positioned between the second portion and the semiconductor layer, the boundary region is positioned between the spacer and the semiconductor layer, and the boundary region has a chemical composition different from that of the spacer.

Ferroelectric memory device

An example semiconductor device includes: n conductive layers including first to nconductive layers stacked in a first direction; a first semiconductor region of a first conductive type; a second semiconductor region of a second conductive type closer to the nconductive layer than the first semiconductor region; a semiconductor layer provided between the first semiconductor region and the second semiconductor region, extending in the first direction, penetrating the n conductive layers, and having an impurity concentration lower than a first conductive impurity concentration of the first region and a second conductive impurity concentration of the second region; n charge storage regions including first to ncharge storage regions provided between the n conductive layers and the semiconductor layer, and a control circuit that controls a voltage applied to the n conductive layers to always prevent charges from being stored in at least one of the n charge storage regions.

System and method for controlling semiconductor memory device including multiple charge storage regions

A semiconductor memory device according to one embodiment includes: a memory cell, the memory cell including a ferroelectric film; and a control circuit controlling the memory cell. Additionally, the control circuit determining whether the number of times of executions of a write process or an erase process on the memory cell has reached a predetermined number of times; and, if the number of times of executions has reached the predetermined number of times, executing a voltage application process in which a first voltage of a first polarity and a second voltage of a second polarity opposite to the first polarity are applied to the ferroelectric film.

According to one embodiment, a semiconductor storage device includes: a first select transistor connected at a first end of a memory string; a second select transistor connected at a second end of the memory string; and a controller. In a write operation of writing data into a first memory cell transistor of the memory string, the controller performs: a first operation of applying a first voltage to a gate of the first memory cell transistor, while turning on the first and second select transistor; and a second operation of applying a second voltage higher than the first voltage to the gate of the first memory cell transistor, while turning off the first and second select transistor; and the second operation is performed after the first operation.

Semiconductor storage device

A semiconductor memory device includes an n-type semiconductor region, first to fourth conductive layers above the n-type semiconductor region, a p-type semiconductor region, a semiconductor layer between the n-type semiconductor region and the p-type semiconductor region and extending through the conductive layers, charge storage regions between the conductive layers and the semiconductor layer, a control circuit that executes a first read sequence and a second read sequence following the first read sequence, a comparison circuit that compares the first data read in the first read sequence to the second data read in the second read sequence, and a determination circuit that selects one of the first data and the second data as a true read value. The first and second read sequences each have an off step and an off voltage applied during the first read sequence is different from an off voltage applied during the second read sequence.

Semiconductor memory device and control method of semiconductor memory device

According to an embodiment, a memory system includes a memory and a computation unit. Into the memory, data are written. The memory stores therein multiple check matrices. Each of the check matrices is associated with the number of errors in the written data. The computation unit is configured to perform a first error correction on the written data by selectively using, from among the check matrices, a check matrix associated with the number of errors recognized in the written data.

Memory system, error correction device, and error correction method

According to an embodiment, an imaging element includes a plurality of light receiving elements, a plurality of scanning circuits, a first line comprising a plurality of nodes, and a plurality of first variable resistance elements. The plurality of scanning circuits are respectively connected to the plurality of light receiving elements. Each of the plurality of first variable resistance elements is connected between the corresponding one of the nodes and a corresponding one of the scanning circuits. At least one of the first variable resistance elements includes a plurality of resistance elements connected to each other in parallel.

Imaging element for use with a retina chip, imaging apparatus including the same, and semiconductor apparatus included in the same

According to an embodiment, a memory system includes first wiring lines; second wiring lines; third wiring lines; fourth wiring lines; and first and second storages. The first storage includes first memory cells arranged at intersections of the first wiring lines and the second wiring lines. Each of the third wiring lines is connected to any one of the first wiring lines. Each of the fourth wiring lines is pre-associated with a logical address specified by a host apparatus. The second storage includes second memory cells arranged at intersections of the third wiring lines and the fourth wiring lines. A resistance state of each of the second memory cells is set to a first resistance state or a second resistance state where a resistance value is lower than that in the first resistance state, according to a correspondence relationship between the logical address and the first wiring line.

Memory system

This semiconductor device comprises: a gate insulating film provided on a surface of a channel layer; a gate electrode provided on an upper surface of the gate insulating film; and a diffusion layer provided in the channel layer. Furthermore, this semiconductor device comprises: a polycrystalline silicon film provided so as to cover a surface of the gate electrode and the diffusion layer; and an inter-layer insulating film provided so as to cover the gate electrode and the polycrystalline silicon film.

Semiconductor device with polycrystalline silicon film

According to an embodiment, a semiconductor storage device includes a first storage unit, a read control unit, a second storage unit, and a write control unit. The first storage unit is configured to store data supplied from a host device. The read control unit is configured to perform control of reading the data in accordance with a read request. The second storage unit is configured to store a logical address used for reading the data from the first storage unit by the read control unit. The write control unit is configured to perform control of adding the stored logical address to the data and write the resulting data into the first storage unit in a case where a size of the data requested to be written into the first storage unit by the host device is smaller than a threshold.

Semiconductor storage device for handling write to nonvolatile memories with data smaller than a threshold

According to an embodiment, a semiconductor circuit includes a substrate, a tunnel oxide film, a charge storage film, a blocking layer, and plural nodes. The substrate is made of a semiconductor in which two diffusion layers each serving as either a source or a drain are formed. The tunnel oxide film is formed on a region of the substrate between the diffusion layers. The charge storage film is formed on the tunnel oxide layer and stores charge. The blocking layer is formed between the charge storage film and a gate electrode and has layers of a first oxide film, a nitride film and a second oxide film to have a thickness of 5 nm or larger but 15 nm or smaller. The nodes allow external application of voltages so that the source and the drain are reversed and allow detection a gate voltage, a drain current and a substrate current.

Semiconductor circuit, D/A converter, mixer circuit, radio communication device, method for adjusting threshold voltage, and method for determining quality of transistor

According to an embodiment, an error correction device includes first calculators, second calculators, estimators, and an inverter. Each first calculator calculates a first message representing a probability that 1-bit data that is input in a corresponding variable node is 1. Each second calculator calculates a second message representing a probability that a value of the data input to the variable node is 1 for each of two or more variable nodes connected to the check node by using the first messages of the variable nodes connected to the check node. Each estimator estimates a true value of the data input to the variable node to generate an estimated value by using the first and second messages. The inverter inverts the estimated value associated with at least one of the variable nodes with a probability higher than 0 and lower than 1.

Growing community of inventors

Kanagawa, Japan

Yusuke Higashi