Omron Corporation

Yusuke Hayashi

Daisuke Inoue

Yuki Ushiro

Hiroyuki Tsuchida

Takaaki Sanda

Hiroto Katsura

Ryota Hasegawa

Kazuaki Miyamoto

Kenji Matsuoka

Makoto Sugimoto

Naomi Uehara

A proximity sensor that outputs presence or absence of a detection object or a position of the detection object as a detection result includes: a detection part configured to include a detection coil and a capacitor; an oscillation circuit configured to excite the detection part; an analog/digital conversion circuit configured to detect a signal change occurring in the detection part and output a digital signal indicating the detected signal change; a temperature detection part configured to detect a temperature inside a casing of the proximity sensor; a storage part configured to store a characteristic parameter unique to the proximity sensor in advance; a control calculation part configured to process a digital signal from the analog/digital conversion circuit to calculate a signal indicating a distance to the detection object, compensate the calculated signal using the characteristics parameter stored in the storage part, and output the compensated signal as the detection result.

Proximity sensor

A method of manufacturing a proximity sensor and a manufacturing system for the proximity sensor capable of improving detection precision or expanding a detectable range are provided. A method of manufacturing a proximity sensor outputting presence or absence of a detection object or a position of the detection object as a detection result is provided. The manufacturing method includes: disposing the proximity sensor in a temperature-changeable environment; setting an environment of the proximity sensor to a plurality of different temperatures respectively and storing temperature detected by the temperature detection part of the proximity sensor in association with the detection result output by the control calculation part at each temperature; determining a characteristic parameter unique to a target proximity sensor based on the stored temperature and detection result; and setting the determined characteristic parameter for the target proximity sensor.

Method of manufacturing proximity sensor and manufacturing system for proximity sensor

To provide an electronic apparatus which enables manufacturing costs to be reduced and a range of selection of materials for resin components to be widened. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and an extension part extending from the base and bonding to the sealing resin part. The bonding intermediating part is fixed to the cable by welding the base onto the sheath.

Electronic apparatus and method of manufacturing same

To provide an electronic apparatus having particularly excellent environmental resistance. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and a cylindrical protrusion protruding toward a tip side of the cable. All of an inner circumferential face and an outer circumferential face of the protrusion and an end face at a tip side of the protrusion in an axial direction are covered by the sealing resin part.

Electronic apparatus and electric cable sealed therein

Growing community of inventors

Kameoka, Japan

Yusuke Hayashi